EP 1258179 A1 20021120 - ELECTRONIC SUPPORTS AND METHODS AND APPARATUS FOR FORMING APERTURES IN ELECTRONIC SUPPORTS
Title (en)
ELECTRONIC SUPPORTS AND METHODS AND APPARATUS FOR FORMING APERTURES IN ELECTRONIC SUPPORTS
Title (de)
ELEKTRONISCHE TRÄGER UND VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG VON LÖCHERN IN ELEKTRONISCHEN TRÄGERN
Title (fr)
SUPPORTS ELECTRONIQUES ET PROCEDES ET APPAREIL DE FORMATION D'ORIFICES DANS DES SUPPORTS ELECTRONIQUES
Publication
Application
Priority
- US 0105680 W 20010222
- US 18397900 P 20000222
- US 18402600 P 20000222
- US 23361900 P 20000918
- US 78353701 A 20010215
Abstract (en)
[origin: WO0163984A1] The present invention provides an electronic support (210) comprising: (A) a prepeg layer (214) comprising: (1) at least one reinforcement material (220); (2) at least one matrix material (216) in contact with at least a portion of the at least one reinforcement material (220); and (B) at least one layer (217) in contact with at least a portion (224) of at least one surface of the prepeg layer (214), the at least one layer (217) comprising at least one inorganic filler (218) and not greater than 25 weight percent of adhesive materials based on the total weight of at least one layer (217) on a total solids basis.
IPC 1-7
IPC 8 full level
B23Q 11/10 (2006.01); B32B 5/28 (2006.01); B32B 27/18 (2006.01); C03C 25/10 (2006.01); C03C 25/47 (2018.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP KR)
B23Q 11/10 (2013.01 - EP); C03C 25/47 (2017.12 - EP); H05K 1/036 (2013.01 - EP); H05K 3/46 (2013.01 - KR); H05K 1/0373 (2013.01 - EP); H05K 3/0047 (2013.01 - EP); H05K 2201/0166 (2013.01 - EP); H05K 2201/0175 (2013.01 - EP); H05K 2201/0209 (2013.01 - EP); H05K 2201/0245 (2013.01 - EP); H05K 2201/029 (2013.01 - EP); H05K 2201/068 (2013.01 - EP); H05K 2201/0769 (2013.01 - EP); H05K 2203/127 (2013.01 - EP)
Citation (search report)
See references of WO 0163984A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 0163984 A1 20010830; AU 4166001 A 20010903; BR 0108561 A 20021112; CA 2400787 A1 20010830; CN 1444838 A 20030924; EP 1258179 A1 20021120; HK 1047678 A1 20030228; JP 2003524302 A 20030812; KR 20020077917 A 20021014; MX PA02008185 A 20040812; TW 550987 B 20030901
DOCDB simple family (application)
US 0105680 W 20010222; AU 4166001 A 20010222; BR 0108561 A 20010222; CA 2400787 A 20010222; CN 01808368 A 20010222; EP 01912926 A 20010222; HK 02109182 A 20021218; JP 2001562068 A 20010222; KR 20027011010 A 20020822; MX PA02008185 A 20010222; TW 90104075 A 20010222