EP 1259987 A1 20021127 - HEAT-CONDUCTING ADHESIVE COMPOUND AND A METHOD FOR PRODUCING A HEAT-CONDUCTING ADHESIVE COMPOUND
Title (en)
HEAT-CONDUCTING ADHESIVE COMPOUND AND A METHOD FOR PRODUCING A HEAT-CONDUCTING ADHESIVE COMPOUND
Title (de)
WÄRMELEITENDE KLEBSTOFFVERBINDUNG UND VERFAHREN ZUM HERSTELLEN EINER WÄRMELEITENDEN KLEBSTOFFVERBINDUNG
Title (fr)
ASSEMBLAGE COLLE THERMOCONDUCTEUR, ET PROCEDE DE REALISATION D'UN ASSEMBLAGE COLLE THERMOCONDUCTEUR
Publication
Application
Priority
- DE 0100054 W 20010109
- DE 10009678 A 20000229
Abstract (en)
[origin: DE10009678C1] Heat conducting adhesive joint between two workpieces (1, 2) comprises a layer (3) of heat conducting material having two flat sided surfaces (31) with openings on each surface defined by hollow chambers (32) in the layer. The joint is arranged between the workpieces so that one of the surfaces contacts one of the workpieces and the other surface contacts the other workpiece. The openings are filled with adhesive (4') to join the workpieces together. An Independent claim is also included for a process for the production of a heat conducting adhesive joint between two workpieces. Preferred Features: The heat conducting material is made of silver. The heat conducting layer is made of sintered metal powder.
[origin: DE10009678C1] Heat conducting adhesive joint between two workpieces (1, 2) comprises a layer (3) of heat conducting material having two flat sided surfaces (31) with openings on each surface defined by hollow chambers (32) in the layer. The joint is arranged between the workpieces so that one of the surfaces contacts one of the workpieces and the other surface contacts the other workpiece. The openings are filled with adhesive (4') to join the workpieces together. An independent claim is also included for a process for the production of a heat conducting adhesive joint between two workpieces. Preferred Features: The heat conducting material is made of silver. The heat conducting layer is made of sintered metal powder.
IPC 1-7
IPC 8 full level
C09J 5/00 (2006.01); C09J 201/00 (2006.01); H01L 21/58 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01)
CPC (source: EP KR US)
H01L 23/373 (2013.01 - KR); H01L 23/3737 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 2224/29101 (2013.01 - EP US); H01L 2224/29111 (2013.01 - EP US); H01L 2224/2919 (2013.01 - EP US); H01L 2224/29339 (2013.01 - EP US); H01L 2224/83193 (2013.01 - EP US); H01L 2224/8384 (2013.01 - EP US); H01L 2224/8385 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/0132 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/0665 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/07811 (2013.01 - EP US); H01L 2924/1301 (2013.01 - EP US); H01L 2924/1305 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US)
Citation (search report)
See references of WO 0165603A1
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
DE 10009678 C1 20010719; EP 1259987 A1 20021127; JP 2003525974 A 20030902; KR 100735933 B1 20070706; KR 20020086588 A 20021118; US 2003020159 A1 20030130; US 6823915 B2 20041130; WO 0165603 A1 20010907
DOCDB simple family (application)
DE 10009678 A 20000229; DE 0100054 W 20010109; EP 01907338 A 20010109; JP 2001564394 A 20010109; KR 20027011287 A 20020828; US 22014702 A 20020827