Global Patent Index - EP 1260002 A1

EP 1260002 A1 2002-11-27 - HOUSING FOR RECEIVING ELECTRIC AND/OR ELECTRONIC ASSEMBLIES

Title (en)

HOUSING FOR RECEIVING ELECTRIC AND/OR ELECTRONIC ASSEMBLIES

Title (de)

GEHÄUSE ZUR AUFNAHME VON ELEKTRISCHEN UND/ODER ELEKTRONISCHEN EINBAUTEN

Title (fr)

COFFRET POUR LE LOGEMENT DE COMPOSANTS ELECTRIQUES ET/OU ELECTRONIQUES

Publication

EP 1260002 A1 (DE)

Application

EP 01909673 A

Priority

  • DE 10007490 A
  • EP 0100670 W

Abstract (en)

[origin: WO0161809A1] The invention relates to a housing for receiving electric and/or electronic assemblies with two parallel plate-like covers which are connected to each other by means of profiled limbs extending vertically with respect to said covers. The profiled limbs are embodied as extruded/pressed profiled sections and are provided with moulded, undercut grooves which are formed as a single piece. The two profiled limbs facing the front side of the housing have an inner surface which is disposed in a vertical position with respect to the front side of the housing. The first undercut groove is built into said inner surfaces, being open in the direction of the inner side of the housing. In order to improve fixing possibilities for said housing, a bearing surface arranged perpendicular to the associated side of the housing is joined to the inner surface at a right angle thereto; a second groove which is open towards the rear side of the housing is built into the bearing surface; a holder is maintained in the first and/or second groove in order to secure the supports for the sub-assemblies; and the holder can be displaced in the direction of the depth of the housing towards the longitudinal extension of said groove when mounted in the first groove and can be displaced in a perpendicular position with respect to the longitudinal extension of the groove in the direction of the width of the housing when mounted in the second groove.

IPC 1-7 (main, further and additional classification)

H02B 1/30; H05K 7/18

IPC 8 full level (invention and additional information)

F16M 1/00 (2006.01); H02B 1/30 (2006.01); H05K 5/02 (2006.01); H05K 7/18 (2006.01)

CPC (invention and additional information)

H05K 7/183 (2013.01); H02B 1/30 (2013.01)

Citation (search report)

See references of WO 0161809A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

EPO simple patent family

WO 0161809 A1 20010823; CN 1401150 A 20030305; DE 10007490 A1 20010913; DE 10007490 C2 20020425; EP 1260002 A1 20021127; JP 2003534644 A 20031118; US 2003146011 A1 20030807

INPADOC legal status


2003-01-15 [18W] APPLICATION WITHDRAWN

- Date of withdrawal: 20021127

2002-11-27 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20020918

2002-11-27 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR