Global Patent Index - EP 1260124 A2

EP 1260124 A2 20021127 - HEAT SINK MODULE AND AN ARRANGEMENT OF HEAT SINK MODULES

Title (en)

HEAT SINK MODULE AND AN ARRANGEMENT OF HEAT SINK MODULES

Title (de)

KÜHLKÖRPERMODUL UND ANORDNUNG VON KÜHLKÖRPERMODULEN

Title (fr)

MODULE DISSIPATEUR THERMIQUE ET ENSEMBLE DE MODULES DISSIPATEURS THERMIQUES

Publication

EP 1260124 A2 20021127 (DE)

Application

EP 01913633 A 20010214

Priority

  • DE 0100557 W 20010214
  • DE 10009398 A 20000228

Abstract (en)

[origin: DE10009398A1] The module is polygon-shaped, e.g. square-shaped, with a heat-generating element fixed to its top side, and cooling fins arranged on its underside. The outer edges have complementary surface structures that care sued to assemble several similar modules in one plane. The surface structures allow one module to be inserted in only one orientation w.r.t another module.

IPC 1-7

H05K 7/20

IPC 8 full level

F28F 3/02 (2006.01); F28F 7/00 (2006.01); H01G 2/08 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP US)

H01G 2/08 (2013.01 - EP US); H01G 11/78 (2013.01 - EP US); Y02E 60/13 (2013.01 - US)

Citation (search report)

See references of WO 0165899A2

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

DE 10009398 A1 20010906; DE 10009398 C2 20020314; EP 1260124 A2 20021127; US 2003047302 A1 20030313; US 6708757 B2 20040323; WO 0165899 A2 20010907; WO 0165899 A3 20011206

DOCDB simple family (application)

DE 10009398 A 20000228; DE 0100557 W 20010214; EP 01913633 A 20010214; US 22017202 A 20020828