Global Patent Index - EP 1261020 A1

EP 1261020 A1 2002-11-27 - WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER

Title (en)

WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER

Title (de)

HALBLEITERSCHEIBENHERSTELLUNGSMETHODE, POLIERMASCHINE UND HALBLEITERSCHEIBE

Title (fr)

PROCEDE DE PRODUCTION DE PLAQUETTES, APPAREIL DE POLISSAGE ET PLAQUETTE

Publication

EP 1261020 A1 (EN)

Application

EP 01976792 A

Priority

  • JP 0109240 W
  • JP 2000326470 A

Abstract (en)

The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof that is strongly required recently, and a wafer. In a polishing process for making a mirror surface of the wafer, a back surface of the wafer is polished to produce a reference plane thereof. <IMAGE>

IPC 1-7 (main, further and additional classification)

H01L 21/304; B24B 37/04

IPC 8 full level (invention and additional information)

H01L 21/302 (2006.01); H01L 21/306 (2006.01)

CPC (invention and additional information)

H01L 21/02024 (2013.01); B24B 37/345 (2013.01)

Designated contracting state (EPC)

AT BE CH CY DE FR GB IT LI

EPO simple patent family

EP 1261020 A1 20021127; EP 1261020 A4 20050119; CN 1217387 C 20050831; CN 1394355 A 20030129; JP 4038429 B2 20080123; JP WO2002035593 A1 20040304; KR 100832942 B1 20080527; KR 100882389 B1 20090205; KR 20080005309 A 20080110; KR 20080005310 A 20080110; TW 508688 B 20021101; US 2003022495 A1 20030130; US 2009057840 A1 20090305; US 7582221 B2 20090901; WO 0235593 A1 20020502

INPADOC legal status


2006-10-11 [18W] APPLICATION WITHDRAWN

- Effective date: 20060808

2005-01-19 [A4] DESPATCH OF SUPPLEMENTARY SEARCH REPORT

- Effective date: 20041203

2004-05-19 [RBV] DESIGNATED CONTRACTING STATES (CORRECTION)

- Designated State(s): AT BE CH CY DE FR GB IT LI

2002-11-27 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20020627

2002-11-27 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR