Global Patent Index - EP 1261077 A2

EP 1261077 A2 2002-11-27 - Reception device for a backplane

Title (en)

Reception device for a backplane

Title (de)

Vorrichtung zur Aufnahme einer Rückwandleiterplatte

Title (fr)

Dispositif de réception pour un circuit imprimé

Publication

EP 1261077 A2 (DE)

Application

EP 02006872 A

Priority

DE 10124814 A

Abstract (en)

The arrangement has a contact arrangement for making contact between the circuit board (16) and the housing for units containing electronic and/or electrical units. The contact arrangement is in the form of sprung contact elements protruding in the direction of a screened surface of the circuit board. The contact elements (17) are arranged on a contact side of the arrangement facing the screened board surface.

Abstract (de)

Die Erfindung betrifft eine Vorrichtung (10) zur Aufnahme einer Leiterplatte (16), insbesondere einer eine Gehäuserückwand bildende Leiterplatte, in einem elektrische und/oder elektronische Baugruppen umfassenden Gehäuse, wobei die Vorrichtung (10) Kontaktmittel (17) zur Kontaktierung der Leiterplatte (16) mit dem Gehäuse aufweist. Die Erfindung sieht vor, daß als Kontaktmittel (17) in Richtung einer Schirmfläche der Leiterplatte federnd vorstehende Kontaktelemente vorgesehen sind, welche Kontaktelemente (17) jeweils einen zungenförmigen Abschnitt (17'') aufweisen, dessen freies Ende (17') derart gekrümmt ist, daß das Ende (17) aus der durch die Anlageseite definierten Ebene federnd vorsteht. <IMAGE>

IPC 1-7 (main, further and additional classification)

H01R 13/648

IPC 8 full level (invention and additional information)

H01R 13/648 (2006.01); H01R 13/658 (2011.01)

CPC (invention and additional information)

H01R 13/6485 (2013.01); H01R 13/6582 (2013.01); H01R 13/6594 (2013.01)

Designated contracting state (EPC)

DE FR GB IT

EPO simple patent family

EP 1261077 A2 20021127; EP 1261077 A3 20060823; EP 1261077 B1 20080611; DE 10124814 A1 20021205; DE 10124814 B4 20051208; DE 50212354 D1 20080724

INPADOC legal status


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