EP 1261077 A3 20060823 - Reception device for a backplane
Title (en)
Reception device for a backplane
Title (de)
Vorrichtung zur Aufnahme einer Rückwandleiterplatte
Title (fr)
Dispositif de réception pour un circuit imprimé
Publication
Application
Priority
DE 10124814 A 20010521
Abstract (en)
[origin: EP1261077A2] The arrangement has a contact arrangement for making contact between the circuit board (16) and the housing for units containing electronic and/or electrical units. The contact arrangement is in the form of sprung contact elements protruding in the direction of a screened surface of the circuit board. The contact elements (17) are arranged on a contact side of the arrangement facing the screened board surface.
IPC 8 full level
H01R 13/648 (2006.01); H01R 13/658 (2006.01)
CPC (source: EP)
H01R 13/6485 (2013.01); H01R 13/6582 (2013.01); H01R 13/6594 (2013.01)
Citation (search report)
- [XY] DE 29808620 U1 19980806 - SIEMENS AG [DE]
- [YX] PATENT ABSTRACTS OF JAPAN vol. 018, no. 687 26 December 1994 (1994-12-26)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1261077 A2 20021127; EP 1261077 A3 20060823; EP 1261077 B1 20080611; DE 10124814 A1 20021205; DE 10124814 B4 20051208; DE 50212354 D1 20080724
DOCDB simple family (application)
EP 02006872 A 20020326; DE 10124814 A 20010521; DE 50212354 T 20020326