EP 1262094 A1 20021204 - METHOD FOR PRODUCING BOND PADS ON A PRINTED CIRCUIT
Title (en)
METHOD FOR PRODUCING BOND PADS ON A PRINTED CIRCUIT
Title (de)
VERFAHREN ZUR HERSTELLUNG VON ANSCHLUSSHÖCKERN AUF EINER LEITERPLATTE
Title (fr)
PROCEDE DE REALISATION DE PLOTS DE CONNEXION SUR UN CIRCUIT IMPRIME
Publication
Application
Priority
- FR 0104117 W 20011220
- FR 0017230 A 20001228
Abstract (en)
[origin: WO02054842A1] The invention concerns a method for producing a chromium coating (4) so that the material of the bond pad (8) remains in a zone totally limited by the chromium coating (4). The invention is applicable to bond pads for electronic components.
IPC 1-7
IPC 8 full level
H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 23/485 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR US)
H01L 21/4853 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 24/11 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H05K 3/3452 (2013.01 - EP US); H05K 3/3473 (2013.01 - EP US); H05K 3/40 (2013.01 - KR); H01L 24/03 (2013.01 - EP); H01L 2224/02166 (2013.01 - EP US); H01L 2224/05001 (2013.01 - EP US); H01L 2224/05016 (2013.01 - EP US); H01L 2224/05018 (2013.01 - EP US); H01L 2224/05022 (2013.01 - EP US); H01L 2224/05023 (2013.01 - EP US); H01L 2224/05571 (2013.01 - EP US); H01L 2224/05576 (2013.01 - EP US); H01L 2224/05671 (2013.01 - EP US); H01L 2224/10126 (2013.01 - EP US); H01L 2224/1147 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H05K 2201/2081 (2013.01 - EP US); H05K 2203/0361 (2013.01 - EP US); H05K 2203/043 (2013.01 - EP US); H05K 2203/0542 (2013.01 - EP US)
Citation (search report)
See references of WO 02054842A1
Designated contracting state (EPC)
DE FI GB SE
DOCDB simple family (publication)
WO 02054842 A1 20020711; EP 1262094 A1 20021204; FR 2819143 A1 20020705; FR 2819143 B1 20030307; JP 2004517500 A 20040610; KR 20020089367 A 20021129; US 2003013045 A1 20030116
DOCDB simple family (application)
FR 0104117 W 20011220; EP 01989644 A 20011220; FR 0017230 A 20001228; JP 2002555597 A 20011220; KR 20027011250 A 20020827; US 20456102 A 20020822