EP 1262525 A1 20021204 - Polyamide composition
Title (en)
Polyamide composition
Title (de)
Polyamidzusammensetzung
Title (fr)
Composition polyamide
Publication
Application
Priority
JP 2001150275 A 20010521
Abstract (en)
Provided is a polyamide composition comprising 50 to 90 parts by weight of (A) semiaromatic polyamides having dicarboxylic acid units containing 60 to 100 mole % of terephthalic acid units and diamine units containing 60 to 100 mole %, in total, of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 50 to 10 parts by weight of (B) aliphatic polyamides in which the average of total carbon atoms of dicarboxylic acid units and diamine units per one amide group is 7 to 12; having excellent moldability, toughness, light-weightness, hot water and steam resistance, heat resistance, mechanical characteristics, low water absorption, chemical resistance and melt stability; and are applicable for molding at low temperature with a conventional steam-heating or a conventional hot-water-heating type mold to give molded articles having sufficient heat resistance, rigidity at high temperature and dimensional stability.
IPC 1-7
IPC 8 full level
C08L 77/00 (2006.01); C08L 77/02 (2006.01); C08L 77/06 (2006.01); C08L 81/04 (2006.01)
CPC (source: EP KR US)
C08L 77/00 (2013.01 - EP KR US); C08L 77/02 (2013.01 - EP US); C08L 77/06 (2013.01 - EP US); C08L 81/04 (2013.01 - EP US)
Citation (search report)
- [A] JP 2001106906 A 20010417 - KURARAY CO
- [A] US 5786423 A 19980728 - TSUMIYAMA TATSUO [JP], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1262525 A1 20021204; CA 2386717 A1 20021121; CN 1255476 C 20060510; CN 1390887 A 20030115; KR 20020089187 A 20021129; TW 593542 B 20040621; US 2003023008 A1 20030130; US 6887930 B2 20050503
DOCDB simple family (application)
EP 02011236 A 20020521; CA 2386717 A 20020517; CN 02141312 A 20020521; KR 20020028065 A 20020521; TW 91110631 A 20020521; US 15096402 A 20020521