EP 1263675 A1 20021211 - THREE-DIMENSIONAL SUSPENDED INTEGRATED MICROSTRUCTURE AND METHOD FOR MAKING SAME
Title (en)
THREE-DIMENSIONAL SUSPENDED INTEGRATED MICROSTRUCTURE AND METHOD FOR MAKING SAME
Title (de)
SCHWEBENDE DREIDIMENSIONALE MIKROINTEGRIERTE STRUKTUR UND HERSTELLUNGSVERFAHREN
Title (fr)
MICROSTRUCTURE INTEGREE SUSPENDUE TRIDIMENSIONELLE ET PROCEDE DE FABRICATION
Publication
Application
Priority
- EP 00960604 A 20000905
- EP 0008655 W 20000905
- EP 99117852 A 19990910
Abstract (en)
[origin: EP1088785A1] The invention concerns a method for making a suspended microstructure comprising the following steps: forming a masking layer on a substrate top surface; structuring the masking layer to form at least an opening substantially defining the surface of said microstructure and for exposing part of the substrate corresponding to said surface; causing by electrochemical process said exposed semiconductor material to become porous over a predetermined thickness; electropolishing the semiconductor material underlying said microstructure made porous to form a cavity enclosing at least partially said microstructure beneath the masking layer level; and releasing said microstructure made porous to form a microstructure suspended to said substrate by at least a connection portion of its perimeter to provide said microstructure with mobility outside the substrate plane.
IPC 1-7
IPC 8 full level
B81B 3/00 (2006.01); B81C 1/00 (2006.01); G02B 7/00 (2006.01); G02B 26/00 (2006.01); G02B 26/08 (2006.01); H01L 21/306 (2006.01); H01L 31/0216 (2006.01)
CPC (source: EP)
B81C 1/00484 (2013.01); G02B 26/001 (2013.01); G02B 26/002 (2013.01); G02B 26/007 (2013.01); G02B 26/0833 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/0114 (2013.01)
Citation (search report)
See references of WO 0119723A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1088785 A1 20010404; EP 1263675 A1 20021211; WO 0119723 A1 20010322
DOCDB simple family (application)
EP 99117852 A 19990910; EP 0008655 W 20000905; EP 00960604 A 20000905