Global Patent Index - EP 1264905 A3

EP 1264905 A3 20021218 - Copper based alloy featuring precipitation hardening and solid-solution hardening

Title (en)

Copper based alloy featuring precipitation hardening and solid-solution hardening

Title (de)

Legierung auf Kupferbasis, gekennzeichnet durch Ausscheidungshärtung und Härtung in der festen Lösung

Title (fr)

Alliage au cuivre présentant des caractéristiques de trempe structurale et de durcissement en solution solide

Publication

EP 1264905 A3 20021218 (EN)

Application

EP 02018195 A 19980821

Priority

  • EP 98943252 A 19980821
  • US 5777997 P 19970905

Abstract (en)

[origin: EP1264905A2] A phosphor bronze alloy consisting of: 0.4 to 3.0wt% Ni, 1.0 to 11.0wt% Sn, 0.1 to 1.0wt% Si, 0.01 to 0.06wt% P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections. <IMAGE>

IPC 1-7

C22C 9/02; C22C 9/06

IPC 8 full level

C22C 9/02 (2006.01); C22C 9/06 (2006.01)

CPC (source: EP)

C22C 9/02 (2013.01); C22C 9/06 (2013.01)

Citation (search report)

  • [XDA] US 4337089 A 19820629 - ARITA KISHIO, et al
  • [Y] US 4971758 A 19901120 - SUZUKI TAKESHI [JP], et al
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 014, no. 480 (C - 0771) 19 October 1990 (1990-10-19)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 010, no. 339 (C - 385) 15 November 1986 (1986-11-15)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 014, no. 334 (C - 0742) 18 July 1990 (1990-07-18)
  • [A] SCHOEDER K-H ET AL: "Werkstoffe für elektrische Kontakte und ihre Anwendungen", 1997, EXPERT-VERLAG, RENNINGEN-MALMSHEIM, GERMANY, XP002217199

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1264905 A2 20021211; EP 1264905 A3 20021218

DOCDB simple family (application)

EP 02018195 A 19980821