Global Patent Index - EP 1268457 A4

EP 1268457 A4 20050720 - REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT

Title (en)

REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT

Title (de)

WIEDERVERARBEITBARE ZUSAMMENSETZUNGEN BESTEHEND AUS EINEM OXIRAN- ODER THIIRAN ENTHALTENDEN RESIN UND EINEM VERNETZUNGSMITTEL

Title (fr)

COMPOSITION REMANIABLE DE RESINE A BASE D'OXIRANES OU DE THIIRANES ET DURCISSEUR

Publication

EP 1268457 A4 20050720 (EN)

Application

EP 01920494 A 20010327

Priority

  • US 0108624 W 20010327
  • US 19354200 P 20000331

Abstract (en)

[origin: WO0174798A1] A composition useful as underfill sealant for the connection of a semiconductor device to a circuit board is reworkable for more easy separation from the semiconductor device and comprises a curable resin having at least one oxirane or thiirane linkage substituted on at least three of the oxirane or thiirane carbon atoms with an alkyl, alkenyl or aryl substituent along with a curing agent selected from anhydrides, amines, amides, imidazoles, and combinations thereof.

IPC 1-7

C07D 301/14; C08G 59/18; C08L 63/00; C08G 59/20; C08G 59/34; H01L 21/56

IPC 8 full level

C07D 301/14 (2006.01); C07D 303/28 (2006.01); C07D 493/08 (2006.01); C08G 59/18 (2006.01); C08G 59/20 (2006.01); C08G 75/08 (2006.01); C08L 63/00 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01)

CPC (source: EP KR)

C07D 303/28 (2013.01 - EP); C07D 493/08 (2013.01 - EP); C08G 59/18 (2013.01 - EP); C08G 59/20 (2013.01 - EP); C08G 59/56 (2013.01 - KR); C08G 75/08 (2013.01 - EP); C08L 63/00 (2013.01 - EP); H01L 2224/16 (2013.01 - EP); H01L 2924/01012 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01077 (2013.01 - EP)

Citation (search report)

  • [X] WO 9420580 A1 19940915 - EASTMAN CHEM CO [US]
  • [A] WO 9935187 A1 19990715 - GEORGIA TECH RES INST [US]
  • [A] US 5726391 A 19980310 - IYER SHRIDHAR R [US], et al
  • [PA] WO 0056799 A1 20000928 - LOCTITE CORP [US], et al
  • [X] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29)
  • [X] PATENT ABSTRACTS OF JAPAN vol. 009, no. 059 (C - 270) 15 March 1985 (1985-03-15)
  • [X] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 11 30 September 1998 (1998-09-30)
  • [A] S.L. BUCHWALTER,E.A.: "CLEAVABLE EPOXY RESINS : DESIGN FOR DISASSEMBLY OF A THERMOSET", JOURNAL OF POLYMER SCIENCE:PART A:POLYMER CHEMISTRY, vol. 34, 1996, pages 249 - 260, XP002329787
  • [A] WANG L ET AL: "Novel thermally reworkable underfill encapsulants for flip-chip applications", ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1998. 48TH IEEE SEATTLE, WA, USA 25-28 MAY 1998, NEW YORK, NY, USA,IEEE, US, 25 May 1998 (1998-05-25), pages 92 - 100, XP010283744, ISBN: 0-7803-4526-6
  • See references of WO 0174798A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0174798 A1 20011011; AU 4754101 A 20011015; CA 2403595 A1 20011011; CN 1232515 C 20051221; CN 1427831 A 20030702; EP 1268457 A1 20030102; EP 1268457 A4 20050720; JP 2003529643 A 20031007; KR 100790081 B1 20071231; KR 20020087442 A 20021122; MX PA02009639 A 20040514

DOCDB simple family (application)

US 0108624 W 20010327; AU 4754101 A 20010327; CA 2403595 A 20010327; CN 01808505 A 20010327; EP 01920494 A 20010327; JP 2001572491 A 20010327; KR 20027012949 A 20020928; MX PA02009639 A 20010327