Global Patent Index - EP 1268874 A1

EP 1268874 A1 20030102 - METAL OR METAL ALLOY BASED SPUTTER TARGET AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

METAL OR METAL ALLOY BASED SPUTTER TARGET AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

SPUTTERTARGET AUF DER BASIS EINES METALLES ODER EINER METALLLEGIERUNG UND VERFAHREN ZU DESSEN HERSTELLUNG

Title (fr)

CIBLE DE PULVERISATION CATHODIQUE A BASE D'UN METAL OU D'UN ALLIAGE METALLIQUE, ET SON PROCEDE DE PRODUCTION

Publication

EP 1268874 A1 20030102 (DE)

Application

EP 01929445 A 20010323

Priority

  • DE 10017414 A 20000407
  • EP 0103310 W 20010323

Abstract (en)

[origin: DE10017414A1] The invention relates to metal or metal alloy based sputter target, preferably with a melting temperature of less than 750 DEG C. The invention also relates to a method for the production of a to metal or metal alloy based sputter target 750 DEG C,preferably with a melting temperature of less than 750 DEG C..

IPC 1-7

C23C 14/34

IPC 8 full level

B22D 25/02 (2006.01); B22F 9/08 (2006.01); B22F 9/10 (2006.01); C22C 12/00 (2006.01); C22C 13/00 (2006.01); C22C 18/00 (2006.01); C22C 28/00 (2006.01); C23C 14/34 (2006.01)

CPC (source: EP US)

C23C 14/3414 (2013.01 - EP US)

Citation (search report)

See references of WO 0177403A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

DE 10017414 A1 20011011; EP 1268874 A1 20030102; JP 2003530485 A 20031014; US 2003168333 A1 20030911; WO 0177403 A1 20011018

DOCDB simple family (application)

DE 10017414 A 20000407; EP 0103310 W 20010323; EP 01929445 A 20010323; JP 2001575252 A 20010323; US 25711803 A 20030508