EP 1272422 A2 20030108 - VACUUM PACKAGE FABRICATION OF MICROELECTROMECHANICAL SYSTEM DEVICES WITH INTEGRATED CIRCUIT COMPONENTS
Title (en)
VACUUM PACKAGE FABRICATION OF MICROELECTROMECHANICAL SYSTEM DEVICES WITH INTEGRATED CIRCUIT COMPONENTS
Title (de)
VACUUMGEHÄUSEHERSTELLUNG MIKROMECHANISCHER SYSTEME MIT INTEGRIERTEN TEILEN
Title (fr)
FABRICATION AVEC ENCAPSULATION SOUS VIDE DE DISPOSITIFS DE SYSTEME MECANIQUE MICROELECTRIQUE COMPRENANT DES COMPOSANTS DE CIRCUITS INTEGRES
Publication
Application
Priority
- US 0103371 W 20010201
- US 49682000 A 20000202
- US 49682600 A 20000202
Abstract (en)
[origin: WO0156921A2] A method for vacuum packaging MEMS devices is provided that comprises forming a plurality of MEMS devices (12) on a device wafer (10). A first sealing ring (16) is formed surrounding one of the MEMS devices (12) and any associated mating pads (70). A plurality of integrated circuit devices (80) is formed on a lid wafer (30) where each integrated circuit device (80) has one or more associated mating pads (82) and one or more associated bonding pads (86). A plurality of second sealing rings (32) is formed on the lid wafer (30) where each of the second sealing rings (32) surrounds one of the integrated circuit devices (80) and any associated bonding pads (82). The second sealing ring (32) is positioned between the perimeter of the integrated circuit device (80) and the associated bonding pads (86). A sealing layer is formed on either each first sealing ring (16) or each second sealing ring (32). The device wafer (10) is mated with the lid wafer (30) in a vacuum environment to form a plurality of vacuum packages where each vacuum package encloses one or more of the MEMS devices (12) and one or more of the integrated circuit devices (80).
IPC 1-7
IPC 8 full level
B81B 7/04 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01); H01L 23/02 (2006.01)
CPC (source: EP KR)
B81B 7/00 (2013.01 - KR); B81B 7/0077 (2013.01 - EP)
Citation (search report)
See references of WO 0156921A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0156921 A2 20010809; WO 0156921 A3 20020307; AU 3475001 A 20010814; EP 1272422 A2 20030108; JP 2003531475 A 20031021; KR 20030023613 A 20030319
DOCDB simple family (application)
US 0103371 W 20010201; AU 3475001 A 20010201; EP 01906897 A 20010201; JP 2001556778 A 20010201; KR 20027009867 A 20020731