Global Patent Index - EP 1272691 B1

EP 1272691 B1 20040317 - ELECTROLYTIC SOLUTION FOR ELECTROCHEMICAL DEPOSIT OF PALLADIUM OR ITS ALLOYS

Title (en)

ELECTROLYTIC SOLUTION FOR ELECTROCHEMICAL DEPOSIT OF PALLADIUM OR ITS ALLOYS

Title (de)

ELEKTROLYTISCHE LÖSUNG ZUR ELEKTROCHEMISCHEN ABSCHEIDUNG VON PALLADIUM ODER DESSEN LEGIERUNGEN

Title (fr)

BAIN ELECTROLYTIQUE DESTINE AU DEPOT ELECTROCHIMIQUE DU PALLADIUM OU DE SES ALLIAGES

Publication

EP 1272691 B1 20040317 (FR)

Application

EP 01921482 A 20010405

Priority

  • FR 0101021 W 20010405
  • FR 0004381 A 20000406

Abstract (en)

[origin: WO0177417A1] The invention concerns an aqueous electrolytic solution with acid pH for electrochemical deposit of palladium or its alloys comprising a palladium compound, and optionally at least a secondary metal compound to be co-deposited in the form of an alloy with the palladium, and comprising further ethylenediamine as complexing agent for the palladium and an organic brightening agent wherein said brightening agent is 3-(3-pyridyl)acrylic acid, 3-(3-quinolyl)acrylic acid or one of their salts. The invention also concerns a method for electroplating palladium or a palladium alloy comprising electrolysis of an electrolytic solution as defined above, using current densities ranging between 0.5 and 150 A/dm<2>.

IPC 1-7

C25D 3/52; C25D 3/56

IPC 8 full level

C25D 3/50 (2006.01); C25D 3/52 (2006.01); C25D 3/56 (2006.01)

CPC (source: EP US)

C25D 3/52 (2013.01 - EP US); C25D 3/567 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0177417 A1 20011018; AT E262055 T1 20040415; AU 4846501 A 20011023; CN 1190522 C 20050223; CN 1430683 A 20030716; DE 60102364 D1 20040422; DE 60102364 T2 20050317; EP 1272691 A1 20030108; EP 1272691 B1 20040317; ES 2220757 T3 20041216; FR 2807450 A1 20011012; FR 2807450 B1 20020705; JP 2003530486 A 20031014; JP 4790191 B2 20111012; US 2003183533 A1 20031002; US 6743346 B2 20040601

DOCDB simple family (application)

FR 0101021 W 20010405; AT 01921482 T 20010405; AU 4846501 A 20010405; CN 01809757 A 20010405; DE 60102364 T 20010405; EP 01921482 A 20010405; ES 01921482 T 20010405; FR 0004381 A 20000406; JP 2001575263 A 20010405; US 23986302 A 20021003