EP 1272887 A1 20030108 - DEVICE FOR LASER CUTTING PREPARATIONS, AND A MICROSCOPE
Title (en)
DEVICE FOR LASER CUTTING PREPARATIONS, AND A MICROSCOPE
Title (de)
VORRICHTUNG ZUM LASERSCHNEIDEN VON PRÄPARATEN UND MIKROSKOP
Title (fr)
DISPOSITIF DE DECOUPAGE LASER DE PREPARATIONS, ET MICROSCOPE
Publication
Application
Priority
- DE 0101082 W 20010321
- DE 10018251 A 20000413
Abstract (en)
[origin: WO0179911A1] The invention relates to a device for laser cutting preparations which comprises an XY table (2) that defines a table surface (4). A holding device (14) for accommodating an object support (6) with a preparation (8) is arranged above the table surface (4) and is joined to the XY table (2) in a manner that permits it to be displaced in the Y direction (20a) in the X direction (22a). An open working space (16) is defined between the holding device (14) and the table surface (4). A catching device (10), which has at least one receptacle (12) for catching a preparation part that has been cut out, can be introduced into said working space. The invention also relates to a microscope that is equipped with the aforementioned laser cutting device.
IPC 1-7
IPC 8 full level
B23K 26/00 (2006.01); B23K 26/10 (2006.01); B23K 26/40 (2006.01); G01N 1/04 (2006.01); G01N 1/28 (2006.01); G02B 21/32 (2006.01)
CPC (source: EP US)
G01N 1/04 (2013.01 - EP US); G01N 1/286 (2013.01 - EP US); G02B 21/32 (2013.01 - EP US)
Citation (search report)
See references of WO 0179911A1
Designated contracting state (EPC)
AT BE CH DE FR GB LI
DOCDB simple family (publication)
WO 0179911 A1 20011025; AU 5210701 A 20011030; DE 10018251 A1 20011025; DE 10018251 C2 20030814; EP 1272887 A1 20030108; JP 2004510955 A 20040408; JP 4146642 B2 20080910; TW 505788 B 20021011; US 2003075530 A1 20030424; US 6907798 B2 20050621
DOCDB simple family (application)
DE 0101082 W 20010321; AU 5210701 A 20010321; DE 10018251 A 20000413; EP 01925307 A 20010321; JP 2001576518 A 20010321; TW 90108913 A 20010504; US 25715302 A 20021009