EP 1273038 A1 20030108 - DEVICE FOR FIXING A HEAT DISTRIBUTION COVER ON A PRINTED CIRCUIT BOARD
Title (en)
DEVICE FOR FIXING A HEAT DISTRIBUTION COVER ON A PRINTED CIRCUIT BOARD
Title (de)
VORRICHTUNG ZUM BEFESTIGEN EINER WÄRMEVERTEILUNGSABDECKUNG AUF EINER LEITERPLATTE
Title (fr)
DISPOSITIF DESTINE A FIXER UN COUVERCLE DE REPARTITION DE CHALEUR SUR UNE CARTE DE CIRCUIT IMPRIME
Publication
Application
Priority
- DE 0101400 W 20010410
- DE 10017925 A 20000411
Abstract (en)
[origin: WO0178142A1] The invention relates to a device for fixing a heat distribution cover (1) on a printed circuit board (2), comprising a plurality of electronic components (4) and a printed conductor level (5) as well as at least one fixing foot (7), which supports a fixing element (8) that can engage with the heat distribution cover (1).
IPC 1-7
IPC 8 full level
H05K 7/20 (2006.01)
CPC (source: EP KR US)
H05K 3/34 (2013.01 - KR); H05K 7/20445 (2013.01 - EP US); H05K 7/205 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US)
Citation (search report)
See references of WO 0178142A1
Designated contracting state (EPC)
AT BE CH CY DE FR GB IT LI
DOCDB simple family (publication)
WO 0178142 A1 20011018; DE 10017925 A1 20011025; EP 1273038 A1 20030108; KR 100488433 B1 20050511; KR 20020087133 A 20021121; US 2003067754 A1 20030410; US 6757171 B2 20040629
DOCDB simple family (application)
DE 0101400 W 20010410; DE 10017925 A 20000411; EP 01942958 A 20010410; KR 20027013566 A 20021010; US 27109702 A 20021011