Global Patent Index - EP 1273040 A2

EP 1273040 A2 20030108 - CONTACTLESS INTERCONNECTION SYSTEM

Title (en)

CONTACTLESS INTERCONNECTION SYSTEM

Title (de)

KONTAKTLOSES VERBINDUNGSSYSTEM

Title (fr)

SYSTEME D'INTERCONNEXION SANS CONTACT

Publication

EP 1273040 A2 20030108 (EN)

Application

EP 01924985 A 20010412

Priority

  • US 0112020 W 20010412
  • US 54863600 A 20000413
  • US 54894000 A 20000413

Abstract (en)

[origin: WO0180316A2] A contactless interconnecting system is provided between a computer chip package and a circuit board. The chip package has a substantially planar lower surface with a pattern of discrete terminal lands. The circuit board has a substantially planar upper surface spaced from and generally parallel to the lower surface of the chip package. A pattern of discrete circuit pads on the upper surface are aligned with the terminal lands. A plurality of discrete interposer members are disposed between the terminal lands and the circuit pads and are in a pattern corresponding to and aligned with the aligned patterns of the terminal lands and circuit pads. The interposer members are preferably of a material having a higher dielectric constant that of the material filling the gaps between interposer members.

IPC 1-7

H01L 23/498; H01L 23/64

IPC 8 full level

H01L 23/12 (2006.01); H01L 23/48 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP KR)

H01L 23/48 (2013.01 - EP); H01L 23/498 (2013.01 - KR); H01L 24/48 (2013.01 - EP); H01L 2224/05599 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/48227 (2013.01 - EP); H01L 2224/85399 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/10253 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP)

Citation (search report)

See references of WO 0180316A2

Designated contracting state (EPC)

DE FR GB SE

DOCDB simple family (publication)

WO 0180316 A2 20011025; WO 0180316 A3 20020321; AU 5158801 A 20011030; CN 1237612 C 20060118; CN 1422440 A 20030604; EP 1273040 A2 20030108; JP 2003531496 A 20031021; JP 3701242 B2 20050928; KR 20020090233 A 20021130; TW 547773 U 20030811

DOCDB simple family (application)

US 0112020 W 20010412; AU 5158801 A 20010412; CN 01807908 A 20010412; EP 01924985 A 20010412; JP 2001577610 A 20010412; KR 20027013712 A 20021012; TW 90205708 U 20010412