EP 1275278 A1 20030115 - COOLING DEVICE FOR COOLING COMPONENTS OF THE POWER ELECTRONICS, SAID DEVICE COMPRISING A MICRO HEAT EXCHANGER
Title (en)
COOLING DEVICE FOR COOLING COMPONENTS OF THE POWER ELECTRONICS, SAID DEVICE COMPRISING A MICRO HEAT EXCHANGER
Title (de)
KÜHLVORRICHTUNG ZUR KÜHLUNG VON BAUELEMENTEN DER LEISTUNGSELEKTRONIK MIT EINEM MIKROWÄRMEÜBERTRAGER
Title (fr)
DISPOSITIF DE REFROIDISSEMENT PERMETTANT DE REFROIDIR DES COMPOSANTS APPARTENANT AU DOMAINE DE L'ELECTRONIQUE DE PUISSANCE AU MOYEN D'UN MICROECHANGEUR THERMIQUE
Publication
Application
Priority
- DE 0100498 W 20010209
- DE 10017971 A 20000411
Abstract (en)
[origin: WO0178478A1] The invention relates to a cooling device, especially for cooling components of the power electronics by means of a refrigerant which flows through a micro heat exchanger (10) that is provided with good heat contact to the component (1). The invention is characterised in that the refrigerant is selected in such a way that said refrigerant evaporates when the desired temperature in the micro heat exchanger (10) has been reached, whereby said temperature pertains to the component.
IPC 1-7
IPC 8 full level
F25D 9/00 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01)
CPC (source: EP KR US)
H01L 23/427 (2013.01 - EP US); H05K 7/20 (2013.01 - KR); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 0178478A1
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
WO 0178478 A1 20011018; DE 10017971 A1 20011025; EP 1275278 A1 20030115; JP 2004509450 A 20040325; KR 20020093897 A 20021216; US 2003178178 A1 20030925
DOCDB simple family (application)
DE 0100498 W 20010209; DE 10017971 A 20000411; EP 01913609 A 20010209; JP 2001575793 A 20010209; KR 20027013507 A 20021009; US 25750903 A 20030519