Global Patent Index - EP 1279016 A1

EP 1279016 A1 20030129 - METHOD AND DEVICE FOR LASER CUTTING MICROSCOPIC SAMPLES

Title (en)

METHOD AND DEVICE FOR LASER CUTTING MICROSCOPIC SAMPLES

Title (de)

VERFAHREN UND VORRICHTUNG ZUM LASERSCHNEIDEN MIKROSKOPISCHER PROBEN

Title (fr)

PROCEDE ET DISPOSITIF POUR DECOUPER AU LASER DES ECHANTILLONS MICROSCOPIQUES

Publication

EP 1279016 A1 20030129 (DE)

Application

EP 01940151 A 20010410

Priority

  • DE 0101414 W 20010410
  • DE 10018255 A 20000413

Abstract (en)

[origin: WO0179806A1] The invention relates to a method and a device for laser cutting microscopic samples. The device for laser cutting microscopic samples comprises a microscope (1) having at least one lens (6) for observing a sample (12) that is to be cut. The lens (6) defines an optical axis (14) and a lens aperture (34). A laser (4) is also connected to the microscope (1). The laser (4) generates a laser beam (41) that is injected into the lens (6) by means of at least one optical system (16). A diaphragm (18) is provided, which generates a dimmed laser beam (4b), whereby the laser aperture (36) generated by the lens (6) is smaller than the lens aperture (34) of the lens (6) itself.

IPC 1-7

G01N 1/04; G01N 1/28; G02B 21/32; B23K 26/00; B23K 26/06

IPC 8 full level

G01N 1/06 (2006.01); B23K 26/00 (2014.01); B23K 26/066 (2014.01); G01N 1/04 (2006.01); G01N 1/28 (2006.01); G02B 21/32 (2006.01)

CPC (source: EP US)

B23K 26/0006 (2013.01 - EP US); B23K 26/066 (2015.10 - EP US); G01N 1/04 (2013.01 - EP US); G01N 1/2813 (2013.01 - EP US); G01N 1/286 (2013.01 - EP US); G02B 21/32 (2013.01 - EP US); B23K 2103/30 (2018.07 - EP US); G01N 2001/045 (2013.01 - EP US); G01N 2001/2886 (2013.01 - EP US); Y10T 83/141 (2015.04 - EP US)

Citation (search report)

See references of WO 0179806A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 0179806 A1 20011025; AU 7383801 A 20011030; DE 10018255 A1 20011025; DE 10018255 C2 20030828; EP 1279016 A1 20030129; JP 2003531369 A 20031021; JP 4236844 B2 20090311; TW 496958 B 20020801; US 2002164678 A1 20021107

DOCDB simple family (application)

DE 0101414 W 20010410; AU 7383801 A 20010410; DE 10018255 A 20000413; EP 01940151 A 20010410; JP 2001576426 A 20010410; TW 90108759 A 20010412; US 12907702 A 20020502