Global Patent Index - EP 1279195 A1

EP 1279195 A1 20030129 - ELECTRONIC COMPONENT WITH FLEXIBLE CONTACT POINTS AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

ELECTRONIC COMPONENT WITH FLEXIBLE CONTACT POINTS AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

ELEKTRONISCHES BAUELEMENT MIT FLEXIBLEN KONTAKTIERUNGSSTELLEN UND VERFAHREN ZU DESSEN HERSTELLUNG

Title (fr)

COMPOSANT ELECTRONIQUE POURVU DE POINTS DE CONTACT FLEXIBLES, ET SON PROCEDE DE FONCTIONNEMENT

Publication

EP 1279195 A1 20030129 (DE)

Application

EP 01929274 A 20010329

Priority

  • DE 0101194 W 20010329
  • DE 10016132 A 20000331

Abstract (en)

[origin: WO0175969A1] The invention relates to an electronic component (2) and a method for the production thereof. The electronic component (2) comprises an electric circuit and a rubber elastic elevation (3). The rubber elastic elevation (3) is made from an insulating rubber elastic material and is arranged on the surface (13) of the electric component (2), having an electric bonding pad (16) on the tip (14) thereof. The rubber elastic elevation (3) also comprises a line path (8) disposed on the sloping side or in the volume thereof between the bonding pad (16) and the electronic circuit.

IPC 1-7

H01L 23/485

IPC 8 full level

H05K 3/32 (2006.01); H01L 21/60 (2006.01); H01L 23/12 (2006.01); H01L 23/485 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP US)

H01L 24/10 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 2224/0231 (2013.01 - EP US); H01L 2224/02379 (2013.01 - EP); H01L 2224/0401 (2013.01 - EP US); H01L 2224/13 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/1319 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01039 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US); H01L 2924/351 (2013.01 - EP US)

C-Set (source: EP US)

  1. H01L 2924/351 + H01L 2924/351 + H01L 2924/00 + H01L 2924/00
  2. H01L 2224/13 + H01L 2224/13 + H01L 2924/00 + H01L 2924/00
  3. H01L 2924/12042 + H01L 2924/12042 + H01L 2924/00 + H01L 2924/00

Citation (search report)

See references of WO 0175969A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0175969 A1 20011011; DE 10016132 A1 20011018; EP 1279195 A1 20030129; JP 2004509449 A 20040325; KR 100527542 B1 20051109; KR 20020086740 A 20021118; TW 529146 B 20030421; US 2003067755 A1 20030410; US 2005127527 A1 20050616; US 6897568 B2 20050524; US 7312533 B2 20071225

DOCDB simple family (application)

DE 0101194 W 20010329; DE 10016132 A 20000331; EP 01929274 A 20010329; JP 2001573547 A 20010329; KR 20027013023 A 20020930; TW 90107664 A 20010330; US 26087202 A 20020930; US 96343404 A 20041012