EP 1281787 A2 20030205 - Additives for accelerator solution for electroless metal plating
Title (en)
Additives for accelerator solution for electroless metal plating
Title (de)
Additive für Beschleunigerslösungen für die stromlose Metallplattierung
Title (fr)
Additifs pour solution accélératrice pour le dépôt chimique d'un métal
Publication
Application
Priority
JP 2001234424 A 20010802
Abstract (en)
Additives for accelerator solutions are provided which contain one or more accelerator solution suspension inhibiting compounds. By using accelerator solutions containing such additives in accelerator treatment processes for electroless copper plating methods, an increase in the turbidity of the accelerator solution can be prevented.
IPC 1-7
IPC 8 full level
C23C 18/16 (2006.01); C23C 18/28 (2006.01); C23C 18/38 (2006.01)
CPC (source: EP KR)
C23C 18/208 (2013.01 - EP); C23C 18/285 (2013.01 - EP); C23C 18/30 (2013.01 - EP); C23C 18/38 (2013.01 - EP KR)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
EP 1281787 A2 20030205; CN 1408899 A 20030409; JP 2003049279 A 20030221; KR 20030013322 A 20030214; TW 548340 B 20030821
DOCDB simple family (application)
EP 02255393 A 20020801; CN 02152914 A 20020802; JP 2001234424 A 20010802; KR 20020045745 A 20020802; TW 91117273 A 20020801