EP 1285101 A1 20030226 - ELECTROPLATING ANNEALED THIN SHEETS AND METHOD FOR PRODUCING THE SAME
Title (en)
ELECTROPLATING ANNEALED THIN SHEETS AND METHOD FOR PRODUCING THE SAME
Title (de)
GALVANNEALED-FEINBLECH UND VERFAHREN ZUM HERSTELLEN VON DERARTIGEM FEINBLECH
Title (fr)
TOLE MINCE RECUITE PAR GALVANISATION ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- DE 10023312 A 20000515
- EP 0105472 W 20010515
Abstract (en)
[origin: DE10023312C1] The present invention relates to a method for producing electroplating annealed thin sheets wherein a hot-rolled strip is produced from IF steel (solid solution interstitial element free steel) containing 0.01-0.1 weight % of silicon. Said hot-rolled strip is coiled at a coiling temperature not less than 700 DEG C and not more than 750 DEG C. A cold-rolled strip is rolled from said hot-rolled strip, coiled and annealed up to recrystallization in an annealing furnace, in a hot gas atmosphere. Thus annealed cold-rolled strip is coated with a zinc coat in a zinc bath then reannealed at an electroplating temperature not less than 500 DEG C and not more than 540 DEG C. The present invention further relates to an electroplating annealed thin sheet with a coating layer having better adhesion on the base material, as well as a method adapted to thin sheet production according to said invention.
IPC 1-7
IPC 8 full level
C23C 2/06 (2006.01); C21D 8/04 (2006.01); C21D 9/46 (2006.01); C22C 18/04 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C23C 2/02 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); B21B 3/02 (2006.01); C21D 1/76 (2006.01)
CPC (source: EP KR US)
B21B 3/02 (2013.01 - KR); C21D 1/76 (2013.01 - KR); C21D 8/0426 (2013.01 - KR); C21D 8/0473 (2013.01 - KR); C21D 8/0478 (2013.01 - EP KR US); C22C 38/004 (2013.01 - EP KR US); C22C 38/02 (2013.01 - EP KR US); C22C 38/04 (2013.01 - EP KR US); C22C 38/12 (2013.01 - EP KR US); C22C 38/14 (2013.01 - EP KR US); C23C 2/0224 (2022.08 - EP KR US); C23C 2/024 (2022.08 - EP KR US); C23C 2/28 (2013.01 - EP US); C23C 2/29 (2022.08 - EP KR US); B21B 3/02 (2013.01 - EP US); C21D 1/76 (2013.01 - EP US); C21D 8/0426 (2013.01 - EP US); C21D 8/0473 (2013.01 - EP US); Y10S 148/902 (2013.01 - EP US); Y10S 428/939 (2013.01 - EP US); Y10T 428/12451 (2015.01 - EP US); Y10T 428/12799 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
DE 10023312 C1 20010823; AU 7403601 A 20011126; CN 1436252 A 20030813; EP 1285101 A1 20030226; JP 2003533595 A 20031111; KR 20030014230 A 20030215; US 2003155048 A1 20030821; US 6887590 B2 20050503; WO 0188216 A1 20011122
DOCDB simple family (application)
DE 10023312 A 20000515; AU 7403601 A 20010515; CN 01810960 A 20010515; EP 0105472 W 20010515; EP 01940473 A 20010515; JP 2001584598 A 20010515; KR 20027015457 A 20021115; US 27615103 A 20030401