Global Patent Index - EP 1285213 B1

EP 1285213 B1 20050406 - MICROSTRUCTURED HEAT EXCHANGER AND METHOD FOR PRODUCING THE SAME

Title (en)

MICROSTRUCTURED HEAT EXCHANGER AND METHOD FOR PRODUCING THE SAME

Title (de)

MIKROSTRUKTUR-WÄRMETAUSCHER UND VERFAHREN ZU DESSEN HERSTELLUNG

Title (fr)

ECHANGEUR DE CHALEUR A MICROSTRUCTURE ET SON PROCEDE DE REALISATION

Publication

EP 1285213 B1 20050406 (DE)

Application

EP 01935996 A 20010426

Priority

  • DE 0101571 W 20010426
  • DE 10022972 A 20000511

Abstract (en)

[origin: WO0186221A1] The invention relates to a microstructured heat exchanger (5) comprising an especially metal hollow fiber structure (10) through which a liquid or a gas flows, and a matrix body (15) that at least partially surrounds said hollow fiber structure (10). The invention also relates to a method for producing such a microstructured heat exchanger. The matrix body (15) is formed by a graphite body, especially by graphite films that are pressed together. In a preferred embodiment, the matrix body (15) is configured in the shape of a board and communicates with a structural part (17) to be cooled in a heat-conductive manner. According to the inventive method, the hollow fiber structure (10) and at least one first partial matrix body (14) and at least one second partial matrix body (14) are provided, at least one of which can be elastically and/or plastically deformed and has a good thermal conductivity. The hollow fiber structure (10) and the partial matrix bodies (14) are then pressed together to give the microstructured heat exchanger (5).

IPC 1-7

F28F 21/02; F28F 1/22

IPC 8 full level

F28F 1/22 (2006.01); F28F 21/02 (2006.01); H01L 23/36 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP KR)

F28F 1/22 (2013.01 - EP); F28F 21/02 (2013.01 - EP KR); F28F 2260/02 (2013.01 - EP)

Designated contracting state (EPC)

DE ES FR GB

DOCDB simple family (publication)

WO 0186221 A1 20011115; DE 10022972 A1 20011122; DE 50105837 D1 20050512; EP 1285213 A1 20030226; EP 1285213 B1 20050406; ES 2240457 T3 20051016; JP 2003533057 A 20031105; KR 100758836 B1 20070919; KR 20020037331 A 20020518

DOCDB simple family (application)

DE 0101571 W 20010426; DE 10022972 A 20000511; DE 50105837 T 20010426; EP 01935996 A 20010426; ES 01935996 T 20010426; JP 2001583120 A 20010426; KR 20027000304 A 20020109