Global Patent Index - EP 1287537 B1

EP 1287537 B1 20040616 - INDUCTIVE MINIATURE COMPONENT FOR SMD-MOUNTING AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

INDUCTIVE MINIATURE COMPONENT FOR SMD-MOUNTING AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

INDUKTIVES MINIATURBAUELEMENT FÜR SMD-MONTAGE, SOWIE VERFAHREN ZU SEINER HERSTELLUNG

Title (fr)

ELEMENT DE CONSTRUCTION MINIATURE INDUCTIF POUR MONTAGE EN SURFACE SMD, ET PROCEDE DE FABRICATION ASSOCIE

Publication

EP 1287537 B1 20040616 (DE)

Application

EP 02735060 A 20020503

Priority

  • DE 0201615 W 20020503
  • DE 10124378 A 20010518

Abstract (en)

[origin: DE10124378A1] The device has at least one coil winding in or on a plastic or ferrite bearer (1) with outwardly protruding connection journals (1.1), about each of which one end (2.1) of the coil winding is wound in several turns. A metallised wire winding (3.1) of electrically conducting wire with diameter greater than that of the coil winding wire is arranged between the journals and the coil winding wire ends and is wound directly onto the journal. AN Independent claim is also included for the following: a method of manufacturing an inventive device.

IPC 1-7

H01F 27/29; H01F 27/28; H01F 17/04

IPC 8 full level

H01F 17/04 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01)

CPC (source: EP US)

H01F 17/045 (2013.01 - EP US); H01F 27/292 (2013.01 - EP US); H01F 27/2828 (2013.01 - EP US)

Designated contracting state (EPC)

DE FI FR GB IT SE

DOCDB simple family (publication)

DE 10124378 A1 20021121; DE 50200524 D1 20040722; EP 1287537 A1 20030305; EP 1287537 B1 20040616; US 2003141955 A1 20030731; US 6788179 B2 20040907; WO 02095776 A1 20021128

DOCDB simple family (application)

DE 10124378 A 20010518; DE 0201615 W 20020503; DE 50200524 T 20020503; EP 02735060 A 20020503; US 31292002 A 20021227