Global Patent Index - EP 1287546 A1

EP 1287546 A1 20030305 - PLASMA ETCHING SYSTEM

Title (en)

PLASMA ETCHING SYSTEM

Title (de)

PLASMAÄTZANLAGE

Title (fr)

INSTALLATION DE GRAVURE AU PLASMA

Publication

EP 1287546 A1 20030305 (DE)

Application

EP 01944922 A 20010510

Priority

  • DE 0101777 W 20010510
  • DE 10024699 A 20000518

Abstract (en)

[origin: WO0188950A1] The invention relates to a plasma etching system (5) particularly for anisotropically etching a substrate (13) by the action of a plasma (21). Said system comprises a first, especially inductively coupled plasma production device (31) which is provided with a first means (11) for generating a first high frequency electromagnetic alternating field; an etching chamber for producing a first plasma (21) from charged particles as a result of the action of said first high frequency electromagnetic alternating field on a first reactive gas with the substrate to be etched; and a first gas supply. A second upstream plasma production device (32) is connected to said first plasma production device (31). Said second plasma production device comprises a second means (20), especially a microwave generator (20), for generating a second high frequency electromagnetic alternating field; a plasma production area (33) for producing a second plasma (18) from charged particles as a result of the action of said second high frequency electromagnetic alternating field on a second reactive gas; and a second gas supply (16). The second plasma (18) thus produced can be fed to the first plasma production device (31) at least partially in the form of a reactive gas via the first gas supply (32).

IPC 1-7

H01J 37/32

IPC 8 full level

H01J 37/32 (2006.01); H01L 21/3065 (2006.01)

CPC (source: EP US)

H01J 37/321 (2013.01 - EP US); H01J 37/32247 (2013.01 - EP US)

Citation (search report)

See references of WO 0188950A1

Designated contracting state (EPC)

DE FR GB NL

DOCDB simple family (publication)

WO 0188950 A1 20011122; DE 10024699 A1 20011129; EP 1287546 A1 20030305; JP 2003533877 A 20031111; US 2002179015 A1 20021205

DOCDB simple family (application)

DE 0101777 W 20010510; DE 10024699 A 20000518; EP 01944922 A 20010510; JP 2001584454 A 20010510; US 3172602 A 20020702