EP 1291132 A3 20040331 - Semiconductor wafer polishing apparatus and polishing method
Title (en)
Semiconductor wafer polishing apparatus and polishing method
Title (de)
Halbleiterscheibepoliervorrichtung und Polierverfahren
Title (fr)
Dsippositif de polissage de plaquette semiconductrice et procédé de polissage
Publication
Application
Priority
JP 2001269640 A 20010906
Abstract (en)
[origin: EP1291132A2] An object of the present invention is to unchange the order of wafers when passed through a wafer outer peripheral part polishing apparatus, thereby simplifying control for each wafer. In predetermined positions of a frame of a wafer outer peripheral part polishing unit, there are arranged and attached a wafer cassette reception and discharge opening unit, a wafer position aligning unit, a wafer notch polishing unit, a wafer circumferential part polishing unit, an inside carrier unit, a first slurry supply device, and a second slurry supply device. The inside carrier unit has a first carrier sub-unit, a second carrier sub-unit, and a third carrier sub-unit. After a wafer taken out from the wafer cassette reception and discharge opening unit is polished, the wafer is returned to the same slot of the same cassette from which it is taken out. Thus, the order is not changed. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 9/00 (2006.01); B24B 9/06 (2006.01); B24B 37/04 (2012.01); B24B 41/00 (2006.01); H01L 21/304 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01)
CPC (source: EP)
B24B 9/065 (2013.01); B24B 41/005 (2013.01)
Citation (search report)
- [Y] EP 1004400 A1 20000531 - SPEEDFAM IPEC CO LTD [JP]
- [Y] EP 1120191 A2 20010801 - TSK AMERICA INC [US]
- [YA] US 5769695 A 19980623 - KATAYAMA ICHIRO [JP]
- [Y] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 07 29 September 2000 (2000-09-29)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
EP 1291132 A2 20030312; EP 1291132 A3 20040331; JP 2003077872 A 20030314; TW I241229 B 20051011
DOCDB simple family (application)
EP 02019759 A 20020904; JP 2001269640 A 20010906; TW 91118855 A 20020821