Global Patent Index - EP 1291904 A3

EP 1291904 A3 20091007 - GaN substrate formed over GaN layer having discretely formed minute holes produced by selective growth

Title (en)

GaN substrate formed over GaN layer having discretely formed minute holes produced by selective growth

Title (de)

GaN-Substrat, das auf einer feinen diskreten Löcher aufweisenden GaN-Schicht gebildet wurde, die durch selektives Wachstum hergestellt worden ist

Title (fr)

Substrat de GaN formé sur une couche de GaN présentant des trous minces discrets réalisés par croissance sélective

Publication

EP 1291904 A3 20091007 (EN)

Application

EP 02019861 A 20020909

Priority

  • JP 2001272895 A 20010910
  • JP 2002134089 A 20020509

Abstract (en)

[origin: EP1291904A2] In a process for producing a substrate for use in a semiconductor element: a growth suppression mask which is constituted by a plurality of mask elements being discretely arranged and each having a width of 2.5 micrometers or smaller is formed on a surface of a base substrate; a first GaN layer having a plurality of holes is formed on the surface of the base substrate by growing GaN from areas of the surface of the base substrate which are not covered by the plurality of first mask elements; and a second GaN layer is formed over the first GaN layer by crystal growth.

IPC 8 full level

H01L 21/20 (2006.01); C30B 25/02 (2006.01); C30B 25/18 (2006.01); C30B 29/38 (2006.01)

CPC (source: EP US)

C30B 25/02 (2013.01 - EP US); C30B 25/18 (2013.01 - EP US); C30B 29/406 (2013.01 - EP US); H01L 21/0237 (2013.01 - EP US); H01L 21/02458 (2013.01 - EP US); H01L 21/0254 (2013.01 - EP US); H01L 21/02576 (2013.01 - EP US); H01L 21/02579 (2013.01 - EP US); H01L 21/0262 (2013.01 - EP US); H01L 21/02639 (2013.01 - EP US); H01L 21/02647 (2013.01 - EP US); H01L 33/007 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

Designated extension state (EPC)

AL LT LV MK RO SI

DOCDB simple family (publication)

EP 1291904 A2 20030312; EP 1291904 A3 20091007; US 2003047746 A1 20030313

DOCDB simple family (application)

EP 02019861 A 20020909; US 23694302 A 20020909