EP 1294534 B2 20060125 - IN-SITU ENDPOINT DETECTION AND PROCESS MONITORING METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING
Title (en)
IN-SITU ENDPOINT DETECTION AND PROCESS MONITORING METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING
Title (de)
VERFAHREN UND VORRICHTUNG ZUR "IN-SITU" ÜBERWACHUNG DER DICKE WÄHREND DES CHEMISCH-MECHANISCHEN PLANIERVORGANGES
Title (fr)
DETECTION DE POINTE IN SITU ET PROCEDE DE SURVEILLANCE DE PROCESSUS AINSI QU'APPAREIL DE POLISSAGE CHIMIQUE MECANIQUE
Publication
Application
Priority
- US 0116290 W 20010518
- US 57400800 A 20000519
- US 21722800 P 20000710
- US 22166800 P 20000727
Abstract (en)
[origin: WO0189765A1] A chemical mechanical polishing apparatus has a polishing pad (30), a carrier (70) to hold a substrate (10) against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad (30) and carrier head (70) for generating relative motion therebetween. An eddy current monitoring system (40) is positioned to generate an alternating magnetic field in proximity to the substrate (10), an optical monitoring system (140) generates a light beam and detects reflections of the light beam from the substrate (10), and a controller (90) receives signals from the eddy current monitoring system (40) and the optical monitoring system (140).
IPC 8 full level
G01B 7/06 (2006.01); B24B 37/005 (2012.01); B24B 37/013 (2012.01); B24B 37/04 (2012.01); B24B 49/00 (2012.01); B24B 49/02 (2006.01); B24B 49/04 (2006.01); B24B 49/10 (2006.01); B24B 49/12 (2006.01); G01B 7/00 (2006.01); H01L 21/283 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR)
B24B 37/005 (2013.01 - KR); B24B 37/013 (2013.01 - EP); B24B 37/04 (2013.01 - KR); B24B 49/00 (2013.01 - KR); B24B 49/02 (2013.01 - EP); B24B 49/04 (2013.01 - EP); B24B 49/10 (2013.01 - EP); B24B 49/12 (2013.01 - EP)
Designated contracting state (EPC)
AT BE CH CY DE FR GB IT LI NL
DOCDB simple family (publication)
WO 0189765 A1 20011129; AT E315980 T1 20060215; DE 60116757 D1 20060406; DE 60116757 T2 20060727; DE 60116757 T4 20070118; DE 60132385 D1 20080221; DE 60132385 T2 20080515; EP 1294534 A1 20030326; EP 1294534 B1 20060118; EP 1294534 B2 20060125; JP 2003534649 A 20031118; JP 2013058762 A 20130328; JP 2014208401 A 20141106; JP 2014209643 A 20141106; JP 5542293 B2 20140709; JP 5778110 B2 20150916; JP 5980843 B2 20160831; JP 6041833 B2 20161214; KR 100827871 B1 20080507; KR 20030001529 A 20030106; TW 496812 B 20020801
DOCDB simple family (application)
US 0116290 W 20010518; AT 01937595 T 20010518; DE 60116757 A 20010518; DE 60116757 T 20010518; DE 60132385 T 20010518; EP 01937595 A 20010518; JP 2001585991 A 20010518; JP 2012221417 A 20121003; JP 2014121990 A 20140613; JP 2014121991 A 20140613; KR 20027015632 A 20010518; TW 90112035 A 20010806