EP 1294801 B1 20050914 - NON-INFLAMMABLE, ANTI-ELECTROSTATIC POLYCARBONATE MOLDING MATERIALS
Title (en)
NON-INFLAMMABLE, ANTI-ELECTROSTATIC POLYCARBONATE MOLDING MATERIALS
Title (de)
FLAMMWIDRIGE UND ANTI-ELEKTROSTATISCHE POLYCARBONAT-FORMMASSEN
Title (fr)
MATIERES MOULABLES DE POLYCARBONATE ININFLAMMABLES ET ANTI-ELECTROSTATIQUES
Publication
Application
Priority
- DE 10027333 A 20000602
- EP 0105779 W 20010521
Abstract (en)
[origin: WO0192418A2] The invention relates to anti-electrostatic polycarbonate compositions which are chlorine and bromine free and non-inflammable and are characterized by good mechanical and thermal properties and by problem-free workability in an injection molding process, that is, good flowability of the molten mass and low tendency to juicing. The invention also relates to the utilization of the inventive polycarbonate molding materials in the production of all sorts of molded bodies and molded parts and to the molded bodies and parts.
IPC 1-7
IPC 8 full level
C08J 5/00 (2006.01); C08K 3/00 (2006.01); C08K 5/51 (2006.01); C08K 5/521 (2006.01); C08K 5/5353 (2006.01); C08K 5/5399 (2006.01); C08L 27/12 (2006.01); C08L 51/00 (2006.01); C08L 67/02 (2006.01); C08L 69/00 (2006.01); C08L 71/02 (2006.01); C08L 85/02 (2006.01); C08L 101/00 (2006.01); C08L 27/18 (2006.01); C08L 55/02 (2006.01)
CPC (source: EP KR US)
C08K 5/51 (2013.01 - EP US); C08L 69/00 (2013.01 - EP KR US); C08L 69/005 (2013.01 - EP US); B82Y 30/00 (2013.01 - KR); C08L 27/18 (2013.01 - EP US); C08L 55/02 (2013.01 - EP US); C08L 71/02 (2013.01 - EP US); C08L 85/02 (2013.01 - EP US)
C-Set (source: EP US)
Citation (examination)
- EP 1125984 A1 20010822 - ASAHI CHEMICAL IND [JP]
- WO 0142362 A1 20010614 - BASF AG [DE], et al
- EP 0286965 A2 19881019 - BAYER AG [DE]
- EP 0869149 A2 19981007 - BAYER AG [DE]
- WO 0000542 A1 20000106 - BAYER AG [DE], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0192418 A2 20011206; WO 0192418 A3 20020328; AR 032339 A1 20031105; AT E304575 T1 20050915; AU 7842601 A 20011211; BR 0111273 A 20030610; BR 0111273 B1 20101130; CA 2410943 A1 20021129; CA 2410943 C 20100216; CN 1214068 C 20050810; CN 1432043 A 20030723; DE 10027333 A1 20011206; DE 50107433 D1 20051020; EP 1294801 A2 20030326; EP 1294801 B1 20050914; JP 2003535182 A 20031125; KR 100695843 B1 20070319; KR 20030007826 A 20030123; MX PA02011796 A 20030514; TW 554007 B 20030921; US 2003171472 A1 20030911; US 6949596 B2 20050927
DOCDB simple family (application)
EP 0105779 W 20010521; AR P010102461 A 20010523; AT 01956439 T 20010521; AU 7842601 A 20010521; BR 0111273 A 20010521; CA 2410943 A 20010521; CN 01810560 A 20010521; DE 10027333 A 20000602; DE 50107433 T 20010521; EP 01956439 A 20010521; JP 2002500616 A 20010521; KR 20027016370 A 20010521; MX PA02011796 A 20010521; TW 90112563 A 20010525; US 29668702 A 20021126