EP 1295321 A1 20030326 - PLANARIZATION PROCESS TO ACHIEVE IMPROVED UNIFORMITY ACROSS SEMICONDUCTOR WAFERS
Title (en)
PLANARIZATION PROCESS TO ACHIEVE IMPROVED UNIFORMITY ACROSS SEMICONDUCTOR WAFERS
Title (de)
PLANARISIERUNGSVERFAHREN ZUR VERBESSERUNG DER GLEICHFÖRMIGKEIT VON HALBLEITERSCHEIBEN
Title (fr)
PROCEDE DE PLANARISATION PERMETTANT D'OBTENIR UNE UNIFORMITE AMELIOREE SUR DES PLAQUETTES DE SEMI-CONDUCTEURS
Publication
Application
Priority
- US 0102616 W 20010126
- US 49164500 A 20000127
- US 49254100 A 20000127
IPC 1-7
IPC 8 full level
H01L 21/3105 (2006.01)
Citation (search report)
See references of WO 0156070A1
Citation (examination)
- US 5923993 A 19990713 - SAHOTA KASHMIR S [US]
- WO 9719467 A1 19970529 - FRANCE TELECOM [FR], et al
- US 5952241 A 19990914 - BAKER DANIEL CLAIRE [US], et al
Designated contracting state (EPC)
AT BE CH CY DE FR GB IE IT LI
DOCDB simple family (publication)
DOCDB simple family (application)
EP 01906705 A 20010126