EP 1295336 A2 20030326 - METHOD FOR PRODUCING A SYSTEM SUPPORT AND ELECTRONIC COMPONENTS
Title (en)
METHOD FOR PRODUCING A SYSTEM SUPPORT AND ELECTRONIC COMPONENTS
Title (de)
HERSTELLUNGSVERFAHREN FÜR EINEN SYSTEMTRÄGER UND FÜR ELEKTRONISCHE BAUTEILE
Title (fr)
PROCEDE DE PRODUCTION D'UN SUPPORT DE SYSTEME ET DE COMPOSANTS ELECTRONIQUES
Publication
Application
Priority
- DE 0102097 W 20010607
- DE 10031204 A 20000627
Abstract (en)
[origin: WO0201634A2] The invention relates to a system support (5) for semiconductor chips (1) and electronic components (2) which are produced on said system support (5). The system support (5) has a base substrate (11) on which outer contact elements (6) are located. These outer contact elements have a cross-section (7) in the form of a rivet with a rivet head area (8), a rivet shaft area (9) and a rivet foot area (10). This ensures that the outer contact elements (6) are securely anchored in the housing, which consists of a plastic mass (4).
IPC 1-7
IPC 8 full level
H01L 23/12 (2006.01); H01L 21/56 (2006.01); H01L 21/68 (2006.01); H01L 23/31 (2006.01); H01L 23/485 (2006.01)
CPC (source: EP KR US)
H01L 21/56 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 21/60 (2021.08 - KR); H01L 23/3107 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/11003 (2013.01 - EP US); H01L 2224/1147 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48471 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US)
Citation (search report)
See references of WO 0201634A2
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 0201634 A2 20020103; WO 0201634 A3 20020620; DE 10031204 A1 20020117; EP 1295336 A2 20030326; JP 2004502303 A 20040122; KR 100614722 B1 20060821; KR 20030011932 A 20030211; US 2003102538 A1 20030605; US 2006060981 A1 20060323; US 6969905 B2 20051129
DOCDB simple family (application)
DE 0102097 W 20010607; DE 10031204 A 20000627; EP 01949240 A 20010607; JP 2002505680 A 20010607; KR 20027017780 A 20010607; US 27424905 A 20051115; US 33044002 A 20021227