EP 1295384 A1 20030326 - ELECTRONIC MICROCOMPONENT, SENSOR AND ACTUATOR INCORPORATING SAME
Title (en)
ELECTRONIC MICROCOMPONENT, SENSOR AND ACTUATOR INCORPORATING SAME
Title (de)
ELEKTRONISCHES MIKROBAUTEIL SOWIE DIESES ENTHALTENDER SENSOR BZW. ANTRIEB
Title (fr)
MICROCOMPOSANT ELECTRONIQUE, CAPTEUR ET ACTIONNEUR INCORPORANT UN TEL MICROCOMPOSANT
Publication
Application
Priority
- FR 0102075 W 20010628
- FR 0008420 A 20000629
Abstract (en)
[origin: WO0201706A1] The invention concerns an electronic microcomponent, produced from a semiconductor substrate wafer (1), comprising two parts, namely a fixed part (10) and a mobile part (11) capable of mutual relative displacement. The invention is characterised in that each part comprises a plurality of plates (20, 21) perpendicular to the main surface of the wafer, the plates (20) of the mobile part (10) being interposed between the plates (21) of the fixed part (11); the plates (21) of the fixed part have an equipotential zone limited by a boundary substantially parallel to the main surface of the wafer (1); the plates (20) of the mobile part (10) have an equipotential zone which, in neutral position, partly covers and extends beyond the surface opposite the equipotential zone of the fixed part (11), such that a difference of potential applied between the equipotential zones of the plates (20, 21) of the fixed (11) and mobile (10') parts, brings about variation in the surface opposite the equipotential zones, and the displacement of the plates (21) of the mobile part perpendicularly to the main surface of the wafer.
IPC 1-7
IPC 8 full level
B81B 3/00 (2006.01); G01P 15/125 (2006.01); H01L 29/84 (2006.01); H02N 1/00 (2006.01)
CPC (source: EP US)
G01P 15/125 (2013.01 - EP US); H02N 1/008 (2013.01 - EP US)
Citation (search report)
See references of WO 0201706A1
Designated contracting state (EPC)
DE DK FR GB
DOCDB simple family (publication)
WO 0201706 A1 20020103; AU 7070301 A 20020108; EP 1295384 A1 20030326; FR 2810976 A1 20020104; FR 2810976 B1 20030829; JP 2004502146 A 20040122; US 2003164042 A1 20030904
DOCDB simple family (application)
FR 0102075 W 20010628; AU 7070301 A 20010628; EP 01949575 A 20010628; FR 0008420 A 20000629; JP 2002505744 A 20010628; US 31198102 A 20021220