EP 1295964 A2 20030326 - Dual microstructure thermal barrier coating
Title (en)
Dual microstructure thermal barrier coating
Title (de)
Wärmesperrschicht mit Doppelmikrostruktur
Title (fr)
Revêtement barrière thermique à double microstructure
Publication
Application
Priority
US 96273401 A 20010924
Abstract (en)
A multi-layer thermal barrier coating (12) having a porous first layer of ceramic insulating material (20) and a second relatively dense layer of ceramic insulating material (22) having a plurality generally vertical gaps (26) formed therein. The porous conventional as-deposited APS microstructure of the first layer provides thermal and chemical protection for the substrate, while the gaps of the columnar-grained second layer provide thermal shock resistance for the coating. An air plasma spray process may be used to deposit both the first and the second layers of material, as well as any underlying bond coat layer. The gaps of the columnar-grained second layer do not extend into the first layer. The pores (28) of the first layer function as crack-arrestors for cracks initiating at the gaps of the second layer. <IMAGE>
IPC 1-7
IPC 8 full level
C23C 4/02 (2006.01); C23C 4/18 (2006.01); C23C 28/00 (2006.01); C23C 28/04 (2006.01)
CPC (source: EP US)
C23C 4/02 (2013.01 - EP US); C23C 4/18 (2013.01 - EP US); C23C 28/3215 (2013.01 - EP US); C23C 28/3455 (2013.01 - EP US); C23C 28/36 (2013.01 - EP US); Y10T 428/12535 (2015.01 - EP US); Y10T 428/12542 (2015.01 - EP US); Y10T 428/12549 (2015.01 - EP US); Y10T 428/12611 (2015.01 - EP US); Y10T 428/24182 (2015.01 - EP US); Y10T 428/24355 (2015.01 - EP US); Y10T 428/24413 (2015.01 - EP US)
Citation (applicant)
US 4457948 A 19840703 - RUCKLE DUANE L [US], et al
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 1295964 A2 20030326; EP 1295964 A3 20040114; EP 1295964 B1 20161102; US 2003228441 A1 20031211; US 6716539 B2 20040406
DOCDB simple family (application)
EP 02078893 A 20020920; US 96273401 A 20010924