EP 1296913 A2 20030402 - PHOTOSTRUCTURED PASTE

Title (en)

PHOTOSTRUCTURED PASTE

Title (de)

PHOTOSTRUKTURIERE PASTE

Title (fr)

PATE PHOTOSTRUCTURABLE

Publication

EP 1296913 A2 20030402 (DE)

Application

EP 01921161 A 20010308

Priority

DE 0100867 W 20010308
DE 10015502 A 20000314

Abstract (en)

[origin: DE10015502A1] Photostructurizable paste, especially for the production of structurized resistance films or wiring traces on green ceramic substrates, contains a filler and light-sensitive organic binder, having a polymer, photoinitiator, thermal polymerization inhibitor, organic disulfide and organic solvent. The filler is a platinum (Pt) powder or its compound or its mixture with a ceramic powder or ceramic precursor compound.

IPC 1-7

C07C 1/00

IPC 8 full level

C04B 41/51 (2006.01); C04B 41/88 (2006.01); C09D 5/25 (2006.01); G01K 7/18 (2006.01); G03F 7/004 (2006.01); G03F 7/031 (2006.01); G03F 7/038 (2006.01); H01B 1/22 (2006.01); H01C 17/065 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01); H05K 3/02 (2006.01)

CPC (source: EP KR US)

C04B 41/009 (2013.01 - EP US); C04B 41/5122 (2013.01 - EP US); C04B 41/88 (2013.01 - EP US); G01K 7/18 (2013.01 - EP US); G03F 7/0047 (2013.01 - EP US); G03F 7/028 (2013.01 - KR); H01C 17/0654 (2013.01 - EP US); H01C 17/06553 (2013.01 - EP US); C04B 2111/00844 (2013.01 - EP US); H05K 1/092 (2013.01 - EP US); H05K 1/167 (2013.01 - EP US); H05K 3/02 (2013.01 - EP US)

Citation (search report)

See references of WO 0168567A2

Designated contracting state (EPC)

CH DE FR GB IT LI

DOCDB simple family (publication)

DE 10015502 A1 20010927; EP 1296913 A2 20030402; JP 2003531456 A 20031021; KR 20030051415 A 20030625; US 2003152863 A1 20030814; WO 0168567 A2 20010920; WO 0168567 A3 20030109

DOCDB simple family (application)

DE 10015502 A 20000314; DE 0100867 W 20010308; EP 01921161 A 20010308; JP 2001567668 A 20010308; KR 20027012001 A 20020913; US 22199503 A 20030130