EP 1298726 A3 20070314 - Solder composition for semiconductor bumps
Title (en)
Solder composition for semiconductor bumps
Title (de)
Lotzusammensetzung für Halbleiter-Höcker
Title (fr)
Composition de soudure pour des bosses sur semi-conducteurs
Publication
Application
Priority
- JP 2001305480 A 20011001
- JP 2002020762 A 20020129
Abstract (en)
[origin: EP1298726A2] A semiconductor device includes a semiconductor element having a plurality of element electrodes and a ball electrode electrically connected to at least one element electrode out of the plurality of element electrodes. The ball electrode is made of a Sn-Zn-based lead-free solder including 7 through 9.5 wt% of zinc and the remaining of tin.
IPC 8 full level
B23K 35/26 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01); H01L 23/485 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR US)
H01L 21/4853 (2013.01 - EP US); H01L 21/60 (2021.08 - KR); H01L 23/3128 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 24/10 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H05K 3/3436 (2013.01 - EP US); H01L 24/05 (2013.01 - EP); H01L 24/45 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05548 (2013.01 - EP US); H01L 2224/05568 (2013.01 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/06131 (2013.01 - EP); H01L 2224/13 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/13109 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/451 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/0103 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01042 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/01322 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/3511 (2013.01 - EP US); H05K 3/3463 (2013.01 - EP US); H05K 3/3485 (2020.08 - EP US); H05K 2201/10992 (2013.01 - EP US); H05K 2203/0545 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Citation (search report)
- [Y] US 5242658 A 19930907 - STEVENS LAURENCE G [US], et al
- [Y] US 5907187 A 19990525 - KOIWA KAORU [JP], et al
- [Y] EP 1038628 A1 20000927 - MITSUI MINING & SMELTING CO [JP]
- [Y] EP 0662732 A1 19950712 - SGS THOMSON MICROELECTRONICS [GB]
- [PY] US 2001050181 A1 20011213 - MIURA KAZUMA [JP], et al
- [PY] US 2002040624 A1 20020411 - NAKAMURA SINZO [JP], et al
- [A] JP H09253882 A 19970930 - SENJU METAL INDUSTRY CO, et al
- [A] EP 0649703 A1 19950426 - INDIUM CORP AMERICA [US]
- [A] EP 1099507 A1 20010516 - MATSUSHITA ELECTRIC IND CO LTD [JP]
- [X] ABTEW M ET AL: "Lead-free Solders in Microelectronics", MATERIALS SCIENCE AND ENGINEERING R: REPORTS, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 27, no. 5-6, June 2000 (2000-06-01), pages 95 - 141, XP004198436, ISSN: 0927-796X
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
Designated extension state (EPC)
AL LT LV MK RO SI
DOCDB simple family (publication)
EP 1298726 A2 20030402; EP 1298726 A3 20070314; JP 2003234433 A 20030822; KR 100559611 B1 20060310; KR 20030028430 A 20030408; TW 577131 B 20040221; US 2003089923 A1 20030515; US 6853077 B2 20050208
DOCDB simple family (application)
EP 02022210 A 20021001; JP 2002020762 A 20020129; KR 20020059689 A 20021001; TW 91122028 A 20020925; US 26040002 A 20021001