Global Patent Index - EP 1299907 A1

EP 1299907 A1 20030409 - ELECTRONIC DEVICE WITH HEAT CONDUCTIVE ENCASING DEVICE

Title (en)

ELECTRONIC DEVICE WITH HEAT CONDUCTIVE ENCASING DEVICE

Title (de)

BRAUSEKOPF FÜR EINE SANITARBRAUSE

Title (fr)

DISPOSITIF ELECTRONIQUE AVEC ENCAPSULANT THERMIQUEMENT CONDUCTEUR

Publication

EP 1299907 A1 20030409 (FR)

Application

EP 01984192 A 20010706

Priority

  • FR 0102187 W 20010706
  • FR 0008916 A 20000707

Abstract (en)

[origin: WO0205346A1] The invention concerns the field of electronic devices with heat conductive encasing device for eliminating part of the energy dissipated by the electronic components contained in the electronic device. It consists in a device comprising: a circuit (7) whereon are arranged several electronic components (8) capable of dissipating energy; a heat conductive cover (1) located opposite the circuit (7); a heat conductive encasing device (4) arranged between the circuit (7) and the cover (1) so as to ensure heat transfer, by conduction towards the cover (1), of the energy dissipated at the components (8); the respective surfaces of the encasing device (4) and of the cover (1) which are mutually opposite comprising an assembly of substantially matching recesses (3, 6) and protrusions (2, 5) for nesting the cover (1) and the encasing device (4), and clearances (j1, j2) are provided between the recesses (3, 6) and protrusions (2, 5) so as to reduce the load exerted by the cover (1) on the encasing device (4) towards the circuit (7) and for maintaining heat conduction between the encasing device (4) and the cover (1) at a level higher than a given conduction threshold. The invention can in particular be used for digital electronic cards.

IPC 1-7

H01L 23/433; H01L 23/367

IPC 8 full level

H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01)

CPC (source: EP US)

H01L 23/36 (2013.01 - EP US); H01L 23/3675 (2013.01 - EP US); H01L 23/433 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 1/0203 (2013.01 - EP US); H05K 3/284 (2013.01 - EP US)

Citation (search report)

See references of WO 0205346A1

Designated contracting state (EPC)

AT BE CH DE FR GB LI

DOCDB simple family (publication)

WO 0205346 A1 20020117; EP 1299907 A1 20030409; FR 2811476 A1 20020111; FR 2811476 B1 20021206; US 2004026798 A1 20040212; US 6924559 B2 20050802

DOCDB simple family (application)

FR 0102187 W 20010706; EP 01984192 A 20010706; FR 0008916 A 20000707; US 43203403 A 20030519