EP 1303773 A2 20030423 - OPTICAL INTERCONNECTION SYSTEM IN A MICROELECTRONIC CIRCUIT PRODUCED ON A SOI SUBSTRATE
Title (en)
OPTICAL INTERCONNECTION SYSTEM IN A MICROELECTRONIC CIRCUIT PRODUCED ON A SOI SUBSTRATE
Title (de)
OPTISCHE VERBINDUNGSSYSTEM IN EINER AUF EINEM SOI SUBSTRAT HERGESTELLTEN MIKROELEKTRONISCHEN SCHALTUNG
Title (fr)
SYSTEME D'INTERCONNEXION OPTIQUE DANS UN CIRCUIT MICROELECTRONIQUE REALISE SUR UN SUBSTRAT SOI
Publication
Application
Priority
- FR 0102456 W 20010726
- FR 0009851 A 20000727
Abstract (en)
[origin: WO0210816A2] The invention concerns an optical interconnection system in a microelectronic circuit produced on a SOI substrate (30), that is a substrate having a silicon film (33) supported by an electrically insulating material (32), the microelectronic circuit comprising at least a functional block to be connected produced in the silicon film. The system comprises at least an optical microguide consisting of a strip (40) delimited in the silicon film by lateral confinement zones (41, 42) to connect the functional block.
IPC 1-7
IPC 8 full level
G02B 6/13 (2006.01); G02B 6/43 (2006.01); G02B 6/12 (2006.01)
CPC (source: EP KR US)
G02B 6/12 (2013.01 - KR); G02B 6/13 (2013.01 - EP US); G02B 6/43 (2013.01 - EP US); G02B 2006/12173 (2013.01 - EP US); G02B 2006/12176 (2013.01 - EP US)
Citation (search report)
See references of WO 0210816A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0210816 A2 20020207; WO 0210816 A3 20020523; AU 7991901 A 20020213; CA 2417143 A1 20020207; EP 1303773 A2 20030423; FR 2812405 A1 20020201; FR 2812405 B1 20030620; JP 2004505310 A 20040219; KR 20030018060 A 20030304; US 2003156778 A1 20030821
DOCDB simple family (application)
FR 0102456 W 20010726; AU 7991901 A 20010726; CA 2417143 A 20010726; EP 01958187 A 20010726; FR 0009851 A 20000727; JP 2002515489 A 20010726; KR 20037000960 A 20030122; US 33322303 A 20030121