Global Patent Index - EP 1303869 A2

EP 1303869 A2 20030423 - HEATED SUBSTRATE SUPPORT ASSEMBLY AND METHOD

Title (en)

HEATED SUBSTRATE SUPPORT ASSEMBLY AND METHOD

Title (de)

GEHEIZTE HALBLEITERSCHEIBENTRÄGERANORDNUNG UND VERFAHREN DAFÜR

Title (fr)

ENSEMBLE SUPPORT DE SUBSTRAT CHAUFFE ET PROCEDE ASSOCIE

Publication

EP 1303869 A2 20030423 (EN)

Application

EP 01959774 A 20010626

Priority

  • US 0141233 W 20010626
  • US 62513100 A 20000725

Abstract (en)

[origin: WO0209162A2] A substrate support assembly 30 comprises a support 38 with a substrate supporting surface 55 and a collar 130 comprising an electrical connector, whereby a voltage may be supplied to the collar 130 through the electrical connector. The collar 130 may pass a current therethrough to resistively heat the collar to a predetermined temperature before substrate processing. In another version, the temperature of the collar 130 may be controlled during and/or before substrate processing.

IPC 1-7

H01L 21/00

IPC 8 full level

H05H 1/46 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01L 21/00 (2006.01); H01L 21/205 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)

CPC (source: EP KR)

C23C 16/4585 (2013.01 - EP); C23C 16/46 (2013.01 - EP); H01L 21/00 (2013.01 - KR); H01L 21/67103 (2013.01 - EP); H01L 21/68785 (2013.01 - EP); H01L 21/67069 (2013.01 - EP)

Citation (search report)

See references of WO 0209162A2

Designated contracting state (EPC)

AT BE CH CY DE FR GB IT LI

DOCDB simple family (publication)

WO 0209162 A2 20020131; WO 0209162 A3 20020613; EP 1303869 A2 20030423; JP 2004505446 A 20040219; KR 20030019607 A 20030306; TW 557532 B 20031011

DOCDB simple family (application)

US 0141233 W 20010626; EP 01959774 A 20010626; JP 2002514773 A 20010626; KR 20037001033 A 20030123; TW 90114901 A 20010619