Global Patent Index - EP 1305806 A1

EP 1305806 A1 20030502 - METHOD FOR PREPARING CONDUCTIVE COMPOSITE MATERIALS BY DEPOSITION OF A CONDUCTIVE POLYMER IN AN INSULATING POROUS SUBSTRATE AND SOLUTION FOR USE IN SAID PREPARATION

Title (en)

METHOD FOR PREPARING CONDUCTIVE COMPOSITE MATERIALS BY DEPOSITION OF A CONDUCTIVE POLYMER IN AN INSULATING POROUS SUBSTRATE AND SOLUTION FOR USE IN SAID PREPARATION

Title (de)

HERSTELLUNG VON ELEKTRISCH LEITFÄHIGEN VERBUNDKÖRPERN DURCH ABSCHEIDUNG EINES LEITFÄHIGEN POLYMERS AUF EINEM PORÖSEN ISOLIERENDEN SUBSTRAT UND LÖSUNG, DIE FÜR DIESE ZUBEREITUNG VERWENDET WIRD

Title (fr)

PREPARATION DE MATERIAUX COMPOSITES CONDUCTEURS PAR DEPOT D'UN POLYMERE CONDUCTEUR DANS UN SUBSTRAT POREUX ISOLANT ET SOLUTION UTILE POUR CETTE PREPARATION

Publication

EP 1305806 A1 20030502 (FR)

Application

EP 01984121 A 20010703

Priority

  • FR 0102127 W 20010703
  • FR 0008737 A 20000705

Abstract (en)

[origin: WO0203396A1] The invention concerns a method for preparing a conductive composite material, which consists in carrying out at least a deposition cycle comprising the following steps: a) contacting an insulating porous substrate (1) with a conductive polymer solution such as polyaniline, in a volatile organic solvent such as trifluoroacetic acid; and b) eliminating the organic solvent by evaporation to form a conductive polymer deposition (5) in the pores (3) of the porous substrate.

IPC 1-7

H01B 1/12; H01M 4/60

IPC 8 full level

C08J 9/36 (2006.01); H01B 1/12 (2006.01); H01B 13/00 (2006.01)

CPC (source: EP US)

H01B 1/128 (2013.01 - EP US)

Citation (search report)

See references of WO 0203396A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0203396 A1 20020110; AT E278242 T1 20041015; DE 60106054 D1 20041104; DE 60106054 T2 20060216; EP 1305806 A1 20030502; EP 1305806 B1 20040929; ES 2228966 T3 20050416; FR 2811466 A1 20020111; FR 2811466 B1 20040220; JP 2004502286 A 20040122; US 2003138566 A1 20030724; US 6753041 B2 20040622

DOCDB simple family (application)

FR 0102127 W 20010703; AT 01984121 T 20010703; DE 60106054 T 20010703; EP 01984121 A 20010703; ES 01984121 T 20010703; FR 0008737 A 20000705; JP 2002507384 A 20010703; US 31289002 A 20021231