EP 1307607 A1 20030507 - METHOD AND DEVICE FOR PLASMA TREATMENT OF MOVING METAL SUBSTRATES
Title (en)
METHOD AND DEVICE FOR PLASMA TREATMENT OF MOVING METAL SUBSTRATES
Title (de)
VERFAHREN UND VORRICHTING ZUR PLASMA-BEHANDLUNG METALLISCHER SUBSTRATE IM DURCHLAUF
Title (fr)
PROCEDE ET DISPOSITIF POUR TRAITER DES SUBSTRATS METALLIQUES AU DEFILE PAR PLASMA
Publication
Application
Priority
- EP 01962488 A 20010806
- BE 0100130 W 20010806
- EP 00202764 A 20000804
Abstract (en)
[origin: EP1178134A1] Metallic substrate (1) is subjected to an electrical discharge (10), i.e. plasma, and a magnetic field between the substrate (1) and a counter-electrode (9). A confining magnetic induction field is created around the substrate so that electrical discharge is uniformly confined around the whole substrate by confinement of electrons liberated in the electrical discharge. Process for the treatment, especially cleaning and/or heating, of a metallic substrate (1) involves moving the metallic substrate (1) continuously in a vacuum chamber (3) having a treatment zone in which a electrical discharge (10), i.e. a plasma, and a magnetic field are produced in a gas maintained at below atmospheric pressure between the substrate (1), which acts as an electrode, and a counter-electrode (9). A confining magnetic induction field is produced around the whole substrate (1) such that the electrical discharge (10) is uniformly confined around the whole substrate in the treatment zone by confinement of electrons liberated in the electrical discharge. An Independent claim is given for a device used for implementation of the process.
IPC 1-7
C23F 4/00; C23G 3/02; C21D 1/56; C23C 14/02; H01J 37/32; H01J 37/34
IPC 8 full level
H05H 1/24 (2006.01); B01J 3/00 (2006.01); B01J 19/08 (2006.01); C21D 1/38 (2006.01); C21D 1/56 (2006.01); C21D 9/56 (2006.01); C23C 14/02 (2006.01); C23F 4/00 (2006.01); C23G 3/02 (2006.01); C23G 5/00 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); H05H 1/46 (2006.01)
CPC (source: EP US)
C21D 1/38 (2013.01 - EP US); C21D 9/561 (2013.01 - EP US); C23C 14/022 (2013.01 - EP US); C23G 5/00 (2013.01 - EP US); H01J 37/32623 (2013.01 - EP US); H01J 37/3266 (2013.01 - EP US)
Citation (search report)
See references of WO 0212591A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1178134 A1 20020206; AU 8371701 A 20020218; BR 0113141 A 20030708; CA 2423138 A1 20020214; EP 1307607 A1 20030507; JP 2004506096 A 20040226; US 2004026412 A1 20040212; US 6933460 B2 20050823; WO 0212591 A1 20020214; ZA 200301533 B 20040225
DOCDB simple family (application)
EP 00202764 A 20000804; AU 8371701 A 20010806; BE 0100130 W 20010806; BR 0113141 A 20010806; CA 2423138 A 20010806; EP 01962488 A 20010806; JP 2002517867 A 20010806; US 34376403 A 20030204; ZA 200301533 A 20030225