EP 1307905 A2 20030507 - PLATING METHOD AND APPARATUS THAT CREATES A DIFFERENTIAL BETWEEN ADDITIVE DISPOSED ON A TOP SURFACE AND A CAVITY SURFACE OF A WORKPIECE USING AN EXTERNAL INFLUENCE
Title (en)
PLATING METHOD AND APPARATUS THAT CREATES A DIFFERENTIAL BETWEEN ADDITIVE DISPOSED ON A TOP SURFACE AND A CAVITY SURFACE OF A WORKPIECE USING AN EXTERNAL INFLUENCE
Title (de)
PLATTIERUNGSVERFAHREN WELCHES DURCH ÄUSSEREN EINFLUSS EINE SPANNUNGSDIFFERENZ ZWISCHEN EINEM ZUSATZSTOFF AUF EINER HÖHEREN OBERFLÄCHE UND EINER VERTIEFUNG EINES WERKSTÜCKS ERZEUGT UND VORRICHTUNG
Title (fr)
PROCEDE DE METALLISATION CREANT, PAR L'INTERMEDIAIRE D'UNE INFLUENCE EXTERIEURE, UN DIFFERENTIEL ENTRE UN ADDITIF DEPOSE SUR UNE SURFACE SUPERIEURE ET UNE SURFACE CREUSE D'UNE PIECE A USINER
Publication
Application
Priority
- US 0124890 W 20010809
- US 22473900 P 20000810
- US 74070100 A 20001218
- US 91978801 A 20010731
Abstract (en)
[origin: WO0215245A2] The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.
IPC 1-7
IPC 8 full level
C25D 5/02 (2006.01); C25D 5/08 (2006.01); C25D 5/18 (2006.01); C25D 5/22 (2006.01); C25D 5/34 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); H01L 23/12 (2006.01)
CPC (source: EP KR US)
C25D 5/22 (2013.01 - EP KR US); C25D 5/34 (2013.01 - EP); H01L 21/288 (2013.01 - KR); H01L 21/2885 (2013.01 - EP); H01L 21/7684 (2013.01 - EP); H01L 21/76877 (2013.01 - EP); H01L 21/76879 (2013.01 - EP)
Citation (search report)
See references of WO 0215245A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0215245 A2 20020221; WO 0215245 A3 20020704; AU 8119601 A 20020225; CN 1310289 C 20070411; CN 1559081 A 20041229; EP 1307905 A2 20030507; JP 2004521186 A 20040715; KR 20030040394 A 20030522; TW 520407 B 20030211
DOCDB simple family (application)
US 0124890 W 20010809; AU 8119601 A 20010809; CN 01815549 A 20010809; EP 01959666 A 20010809; JP 2002520283 A 20010809; KR 20037001967 A 20030210; TW 90119667 A 20010810