EP 1307910 A1 20030507 - MICROMACHINED SENSOR WITH INSULATING PROTECTION OF CONNECTIONS
Title (en)
MICROMACHINED SENSOR WITH INSULATING PROTECTION OF CONNECTIONS
Title (de)
MIKROVERARBEITETER SENSOR MIT ISOLIERENDEM VERBINDUNGSSCHUTZ
Title (fr)
CAPTEUR MICRO-USINE AVEC PROTECTION ISOLANTE DES CONNEXIONS
Publication
Application
Priority
- FR 0102567 W 20010807
- FR 0010581 A 20000811
Abstract (en)
[origin: WO0215256A1] The invention concerns sensors of physical quantities such as pressure or acceleration sensors, and more precisely the mounting of the sensor active part on a base (30) bearing connection pins (32). The invention is characterised in that it consists in preparing an active part of the sensor, consisting for example of micromachined silicon wafers (10, 12) bearing electronic elements, electrical conductors, and bond pads (22); likewise preparing a base (30) provided with pins (32) and electrically connecting the bond pads (22) to the pin ends with conductive elements (wires 40); then in immersing the wafer and the pin ends in an electrolytic solution, so as to perform an electrolytic plating of conductive metal (42) on the pin ends, the pads and the conductor elements connecting them; finally oxidizing and nitriding said metal to form an insulating coat (44) on the ends of the connection pins, the pads and the conductive elements connecting them. The invention is applicable to pressure, force, acceleration sensors and the like, designed to operate in harsh environment.
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/49 (2006.01)
CPC (source: EP US)
H01L 24/48 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/16235 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/4554 (2013.01 - EP US); H01L 2224/456 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/4823 (2013.01 - EP US); H01L 2224/4847 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2224/8192 (2013.01 - EP US); H01L 2224/8592 (2013.01 - EP US); H01L 2224/92247 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01042 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01073 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/04953 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/15312 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US)
Citation (search report)
See references of WO 0215256A1
Designated contracting state (EPC)
DE FR
DOCDB simple family (publication)
WO 0215256 A1 20020221; EP 1307910 A1 20030507; FR 2812968 A1 20020215; FR 2812968 B1 20030801; US 2002153257 A1 20021024; US 6825512 B2 20041130
DOCDB simple family (application)
FR 0102567 W 20010807; EP 01963069 A 20010807; FR 0010581 A 20000811; US 8997402 A 20020408