EP 1307911 A1 20030507 - SENSOR MICRO-MACHINED WITH ELECTROLYTIC WELDING AND METHOD FOR MAKING SAME
Title (en)
SENSOR MICRO-MACHINED WITH ELECTROLYTIC WELDING AND METHOD FOR MAKING SAME
Title (de)
MIKROVERARBEITETER SENSOR MIT ELEKTROLYTISCHER SCHWEISSUNG UND DESSEN HERSTELLUNGSVERFAHREN
Title (fr)
CAPTEUR MICRO-USINE AVEC SOUDURE ELECTROLYTIQUE ET PROCEDE DE FABRICATION
Publication
Application
Priority
- FR 0102568 W 20010807
- FR 0010582 A 20000811
Abstract (en)
[origin: WO0215257A1] The invention concerns sensors of physical quantities such as pressure or acceleration sensors, or more precisely the mounting of the active part of the sensor on a base plate (30) bearing connection pins (32). The invention is characterised in that it consists in: preparing an active part of the sensor, consisting for example of micro-machined silicon plates (10, 12) bearing electronic components, electrical conductors, and bond pads (22); likewise preparing a base plate (30) provided with pins (32) whereof the top ends are arranged in the space each opposite a respective pad (22); pressing the surface bearing the pads against the top part of the pins, and immersing the whole assembly into an electrolytic solution to deposit metal (34) which is urged to rigidly weld the pins on the pads. Preferably the conductive parts (pads and pins) of the assembly are then covered with an insulation (36), to avoid electrical leaks between the pins subjected to different potentials.
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01)
CPC (source: EP US)
H01L 24/81 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01073 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 0215257A1
Designated contracting state (EPC)
AT BE DE FR
DOCDB simple family (publication)
WO 0215257 A1 20020221; EP 1307911 A1 20030507; FR 2812969 A1 20020215; FR 2812969 B1 20030801; US 2002152798 A1 20021024; US 6647759 B2 20031118
DOCDB simple family (application)
FR 0102568 W 20010807; EP 01963070 A 20010807; FR 0010582 A 20000811; US 11006502 A 20020408