EP 1310989 A1 20030514 - DETERGENT COMPOSITION
Title (en)
DETERGENT COMPOSITION
Title (de)
REINIGUNGSMITTELZUSAMMENSETZUNG
Title (fr)
COMPOSITION DETERGENTE
Publication
Application
Priority
- JP 0105091 W 20010614
- JP 2000181141 A 20000616
Abstract (en)
To provide a detergent composition which has little corrosion to a wiring material and is excellent in cleaning ability of a semiconductor substrate or semiconductor device on which the fine particles and the metal impurities are deposited. A detergent composition comprising a reducing agent, wherein the detergent composition has an oxidation-reduction potential at 25 DEG C of +0.2 V or less, and a pH at 25 DEG C of from 3 to 12; and a cleaning process of a semiconductor substrate or a semiconductor device using the detergent composition.
IPC 1-7
IPC 8 full level
C11D 3/00 (2006.01); C11D 7/02 (2006.01); C11D 7/26 (2006.01); C11D 7/34 (2006.01); C11D 11/00 (2006.01); C23G 1/20 (2006.01); H01L 21/306 (2006.01)
CPC (source: EP KR US)
C11D 3/0042 (2013.01 - EP KR US); C11D 7/02 (2013.01 - EP US); C11D 7/26 (2013.01 - EP US); C11D 7/265 (2013.01 - EP KR US); C11D 7/268 (2013.01 - EP KR US); C11D 7/34 (2013.01 - EP KR US); C23G 1/20 (2013.01 - EP KR US); H01L 21/02052 (2013.01 - KR); C11D 2111/22 (2024.01 - EP KR US); H01L 21/02052 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB IE
DOCDB simple family (publication)
EP 1310989 A1 20030514; EP 1310989 A4 20030716; EP 1310989 B1 20051214; DE 60115909 D1 20060119; DE 60115909 T2 20060907; KR 100867287 B1 20081106; KR 20030007969 A 20030123; KR 20080011243 A 20080131; US 2003158059 A1 20030821; US 7396806 B2 20080708; WO 0197268 A1 20011220
DOCDB simple family (application)
EP 01941051 A 20010614; DE 60115909 T 20010614; JP 0105091 W 20010614; KR 20027017099 A 20021214; KR 20087000669 A 20080109; US 31147102 A 20021216