EP 1312116 A1 20030521 - METHOD FOR DISTRIBUTED SHIELDING AND/OR BYPASS FOR ELECTRONIC DEVICE WITH THREE-DIMENSIONAL INTERCONNECTION
Title (en)
METHOD FOR DISTRIBUTED SHIELDING AND/OR BYPASS FOR ELECTRONIC DEVICE WITH THREE-DIMENSIONAL INTERCONNECTION
Title (de)
VERTEILTES ABSCHIRMUNGS- UND/ODER ENTKOPPLUNGSVERFAHREN FÜR VORRICHTUNG MIT DREIDIMENSIONALER VERDRAHTUNGSSTRUKTUR
Title (fr)
PROCEDE DE BLINDAGE ET/OU DE DECOUPLAGE REPARTIS POUR UN DISPOSITIF ELECTRONIQUE A INTERCONNEXION EN TROIS DIMENSIONS
Publication
Application
Priority
- FR 0102382 W 20010720
- FR 0009731 A 20000725
Abstract (en)
[origin: WO0209182A1] The invention concerns a method for distributed shielding and bypass for an electronic device with integrated components having three-dimensional interconnection, the inventive device and a method for making same. The device comprises, associated with each active component (2), at least a capacitor plane consisting of a thin foil (10) made of metal-coated dielectric material (11, 12) on its two planar surfaces. The components and capacitor planes are stacked and alternately assembled to form a block (1') whereof the side surfaces (21 to 24) bear conductors (13, 14) providing the three-dimensional interconnection. The metal coatings (11, 12) are delimited to be flush with the edges of the block only through tabs (110, 120). One of the metal coatings (11) connected to the ground acts as shield. The invention is particularly useful for producing very compact storage blocks.
IPC 1-7
IPC 8 full level
H01G 4/33 (2006.01); H01G 4/40 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 23/58 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01)
CPC (source: EP US)
H01L 23/5225 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H01L 23/585 (2013.01 - EP US); H01L 23/642 (2013.01 - EP US); H01L 25/0657 (2013.01 - EP US); H01L 2225/06527 (2013.01 - EP US); H01L 2225/06541 (2013.01 - EP US); H01L 2225/06551 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 0209182A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0209182 A1 20020131; EP 1312116 A1 20030521; FR 2812453 A1 20020201; FR 2812453 B1 20040820; JP 2004505451 A 20040219; US 2003173673 A1 20030918
DOCDB simple family (application)
FR 0102382 W 20010720; EP 01956626 A 20010720; FR 0009731 A 20000725; JP 2002514788 A 20010720; US 33385503 A 20030124