Global Patent Index - EP 1313590 A1

EP 1313590 A1 20030528 - METHOD AND INSTALLATION FOR HYBRID LASER/ARC WELDING USING A POWER-DIODE LASER

Title (en)

METHOD AND INSTALLATION FOR HYBRID LASER/ARC WELDING USING A POWER-DIODE LASER

Title (de)

VERFAHREN UND VORRICHTUNG ZUR HYBRID-SCHWEISSEN UNTER VERWENDUNG EINES HOCHLEISTUNGSDIODENLASERS

Title (fr)

PROCEDE ET INSTALLATION DE SOUDAGE HYBRIDE LASER-ARC UTILISANT UN LASER A DIODES DE PUISSANCE

Publication

EP 1313590 A1 20030528 (FR)

Application

EP 01963047 A 20010802

Priority

  • FR 0102523 W 20010802
  • FR 0010753 A 20000821

Abstract (en)

[origin: WO0216071A1] The invention concerns a method for welding one or several metal components to be assembled by producing at least one weld joint on said metal components to be welded, said weld joint being obtained by using a laser beam and at least an electric arc, which consists in generating said laser beam using a power-diode laser device. The invention also concerns an installation for implementing the welding method. The invention is useful for welding abutted flanks designed to constitute at least part of a motor vehicle body component.

IPC 1-7

B23K 26/14

IPC 8 full level

B23K 9/16 (2006.01); B23K 10/02 (2006.01); B23K 26/00 (2006.01); B23K 26/12 (2006.01); B23K 26/14 (2006.01); B23K 26/20 (2006.01); B23K 26/30 (2006.01); H01S 3/00 (2006.01)

CPC (source: EP US)

B23K 26/123 (2013.01 - EP US); B23K 26/125 (2013.01 - EP US); B23K 26/302 (2015.10 - EP US); B23K 26/348 (2015.10 - EP US); B23K 2101/006 (2018.07 - EP US); B23K 2101/185 (2018.07 - EP US); B23K 2103/04 (2018.07 - EP US); B23K 2103/05 (2018.07 - EP US); B23K 2103/10 (2018.07 - EP US)

Citation (search report)

See references of WO 0216071A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0216071 A1 20020228; AU 8409701 A 20020304; EP 1313590 A1 20030528; FR 2813031 A1 20020222; FR 2813031 B1 20030124; JP 2004525766 A 20040826; US 2003173343 A1 20030918

DOCDB simple family (application)

FR 0102523 W 20010802; AU 8409701 A 20010802; EP 01963047 A 20010802; FR 0010753 A 20000821; JP 2002520983 A 20010802; US 36237803 A 20030218