EP 1314196 A1 20030528 - METHOD FOR MAKING AN INTEGRATED CIRCUIT CAPABLE OF BEING SURFACE-MOUNTED AND RESULTING CIRCUIT
Title (en)
METHOD FOR MAKING AN INTEGRATED CIRCUIT CAPABLE OF BEING SURFACE-MOUNTED AND RESULTING CIRCUIT
Title (de)
HERSTELLUNGSVERFAHREN FÜR EINEN AUF EINER OBERFLÄCHE MONTIERBAREN INTEGRIERTEN SCHALTKREIS UND DADURCH HERGESTELLTER SCHALTKREIS
Title (fr)
PROCEDE DE FABRICATION DE CIRCUIT INTEGRE DE TYPE MONTABLE EN SURFACE ET CIRCUIT ISSU DU PROCEDE
Publication
Application
Priority
FR 0002063 W 20000718
Abstract (en)
[origin: WO0207208A1] The invention concerns a method for making an integrated circuit (40) capable of being surface-mounted which consists in first making a housing with a rear face and an array of connection pins extending underneath said rear surface perpendicular thereto, and then in forming at the end of each pin a ball (44) of alloy with low melting point enclosing said end and welded thereto. The invention also concerns an integrated circuit (40) capable of being surface-mounted, comprising a housing with a rear surface and an array of connection pins, with substantially constant cross-section along the pin, extending underneath said rear surface perpendicular thereto. A ball (44) of alloy with low melting point is welded to the end of each pin (42) enclosing said end. The invention is applicable to surface-mounted integrated circuits.
IPC 1-7
IPC 8 full level
H01L 23/12 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H05K 3/34 (2006.01); H01R 43/02 (2006.01)
CPC (source: EP KR US)
H01L 21/4853 (2013.01 - EP US); H01L 23/12 (2013.01 - KR); H01L 23/13 (2013.01 - EP US); H01L 23/49811 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H05K 3/3426 (2013.01 - EP US); H05K 3/3485 (2020.08 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/11822 (2013.01 - EP US); H01L 2224/1308 (2013.01 - EP US); H01L 2224/13082 (2013.01 - EP US); H01L 2224/131 (2013.01 - EP US); H01L 2224/1316 (2013.01 - EP US); H01L 2224/13582 (2013.01 - EP US); H01L 2224/13644 (2013.01 - EP US); H01L 2224/13655 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01R 43/0249 (2013.01 - EP US); H01R 43/0256 (2013.01 - EP US); H05K 2201/10704 (2013.01 - EP US); H05K 2201/10984 (2013.01 - EP US); H05K 2203/0113 (2013.01 - EP US); H05K 2203/0338 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Citation (search report)
See references of WO 0207208A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0207208 A1 20020124; AU 6577200 A 20020130; CA 2416502 A1 20020124; EP 1314196 A1 20030528; IL 154002 A0 20030731; JP 2004504722 A 20040212; KR 20030059078 A 20030707; US 6989591 B1 20060124
DOCDB simple family (application)
FR 0002063 W 20000718; AU 6577200 A 20000718; CA 2416502 A 20000718; EP 00953253 A 20000718; IL 15400200 A 20000718; JP 2002513012 A 20000718; KR 20037000827 A 20030118; US 33325203 A 20030117