Global Patent Index - EP 1315598 A2

EP 1315598 A2 2003-06-04 - METHOD AND APPARATUS FOR MEASURING A POLISHING CONDITION

Title (en)

METHOD AND APPARATUS FOR MEASURING A POLISHING CONDITION

Title (de)

VERFAHREN UND VORRICHTUNG ZUM MESSEN EINES POLIERZUSTANDES

Title (fr)

PROCEDE ET APPAREIL PERMETTANT DE MESURER UN ETAT DE POLISSAGE

Publication

EP 1315598 A2 (EN)

Application

EP 01956736 A

Priority

  • IB 0101532 W
  • US 65289800 A

Abstract (en)

[origin: WO0218100A2] In a method for determining the condition of the surface, such as thickness or reflectivity, of any specific location on a wafer (16) during a chemical mechanical polishing (CMP), at first, a location of a measurement site on the wafer surface is selected. Second, a picture (22) of the surface within the measurement site is taken, for example, through a window (14). Third, the picture is analyzed. This provides an exact endpointing and an exact final thickness of a specific layer on the wafer.

IPC 1-7 (main, further and additional classification)

B24B 37/04; B24B 49/12

IPC 8 full level (invention and additional information)

B24B 37/013 (2012.01); B24B 49/12 (2006.01); H01L 21/304 (2006.01)

CPC (invention and additional information)

B24B 37/013 (2013.01); B24B 49/12 (2013.01)

Citation (search report)

See references of WO 0218100A3

Designated contracting state (EPC)

DE FR IE

EPO simple patent family

WO 0218100 A2 20020307; WO 0218100 A3 20020516; EP 1315598 A2 20030604; JP 2004507900 A 20040311; KR 20030024920 A 20030326; TW 534854 B 20030601

INPADOC legal status


2005-09-28 [18R] REFUSED

- Effective date: 20050508

2004-12-08 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: FREESCALE SEMICONDUCTOR, INC.

2004-05-12 [RBV] DESIGNATED CONTRACTING STATES (CORRECTION)

- Designated State(s): DE FR IE

2004-04-07 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20040223

2003-06-04 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20030331

2003-06-04 [AK] DESIGNATED CONTRACTING STATES:

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR