Global Patent Index - EP 1315780 A2

EP 1315780 A2 20030604 - THERMOCURABLE ELECTROCONDUCTIVE ADHESIVE SHEET, CONNECTION STRUCTURE AND CONNECTION METHOD USING THE SAME

Title (en)

THERMOCURABLE ELECTROCONDUCTIVE ADHESIVE SHEET, CONNECTION STRUCTURE AND CONNECTION METHOD USING THE SAME

Title (de)

WÄRMEVERNETZBARE, ELEKTRISCH LEITENDE KLEBEFOLIE, VERBINDUNGSSTRUKTUR UND DIE FOLIE VERWENDENDE VERBINDUNGSMETHODE

Title (fr)

FEUILLE ADHESIVE THERMODURCISSABLE ELECTROCONDUCTRICE, STRUCTURE DE CONNEXION ET PROCEDE DE CONNEXION L'UTILISANT

Publication

EP 1315780 A2 20030604 (EN)

Application

EP 01968695 A 20010907

Priority

  • JP 2000273119 A 20000908
  • US 0128141 W 20010907

Abstract (en)

[origin: WO0220686A2] A thermocurable electroconductive adhesive sheet which is able to make an electric connection having mechanical, thermal and electric stability, and low resistance, produced by a simple and easy process is provided.

IPC 1-7

C09J 7/02; C09J 5/06; H01R 4/04

IPC 8 full level

B32B 3/30 (2006.01); C09J 5/06 (2006.01); C09J 7/02 (2006.01); C09J 7/28 (2018.01); C09J 163/00 (2006.01); C09J 171/10 (2006.01); H01B 5/14 (2006.01); H01B 17/62 (2006.01); H01R 4/04 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01)

CPC (source: EP KR US)

C09J 5/06 (2013.01 - EP KR); C09J 7/28 (2017.12 - EP KR US); C09J 7/35 (2017.12 - KR); H01R 4/04 (2013.01 - EP KR); H05K 3/321 (2013.01 - EP KR US); H05K 3/4015 (2013.01 - KR); C09J 2301/124 (2020.08 - EP); C09J 2301/314 (2020.08 - EP); C09J 2461/00 (2013.01 - EP KR); C09J 2463/00 (2013.01 - EP KR); H05K 3/4015 (2013.01 - EP); H05K 2201/0382 (2013.01 - EP KR); H05K 2201/1028 (2013.01 - EP KR); H05K 2203/1189 (2013.01 - EP KR)

Citation (search report)

See references of WO 0220686A2

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0220686 A2 20020314; WO 0220686 A3 20020606; AU 8892501 A 20020322; CN 100469851 C 20090318; CN 1639290 A 20050713; EP 1315780 A2 20030604; JP 2002097424 A 20020402; KR 100617410 B1 20060901; KR 20040030406 A 20040409

DOCDB simple family (application)

US 0128141 W 20010907; AU 8892501 A 20010907; CN 01815407 A 20010907; EP 01968695 A 20010907; JP 2000273119 A 20000908; KR 20037003369 A 20030307